SLAAEG4B October   2023  – July 2025 MSPM0C1104 , MSPM0C1105 , MSPM0C1106 , MSPM0H3216 , MSPM0L1306

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1 MSPM0C Hardware Design Check List
  5. 2 Power Supplies in MSPM0C Devices
    1. 2.1 Digital Power Supply
    2. 2.2 Analog Power Supply
    3. 2.3 Built-in Power Supply and Voltage Reference
    4. 2.4 Recommended Decoupling Circuit for Power Supply
  6. 3 Reset and Power Supply Supervisor
    1. 3.1 Digital Power Supply
    2. 3.2 Power Supply Supervisor
      1. 3.2.1 Power-On Reset (POR) Monitor
      2. 3.2.2 Brownout Reset (BOR) Monitor
      3. 3.2.3 POR and BOR Behavior During Supply Changes
  7. 4 Clock System
    1. 4.1 Internal Oscillators
      1. 4.1.1 Internal Low-Frequency Oscillator (LFOSC)
      2. 4.1.2 Internal System Oscillator (SYSOSC)
    2. 4.2 External Oscillators & External Clock Input
      1. 4.2.1 Low-Frequency Crystal Oscillator (LFXT)
      2. 4.2.2 LFCLK_IN (Digital Clock)
      3. 4.2.3 High-Frequency Crystal Oscillator (HFXT)
      4. 4.2.4 HFCLK_IN (Digital Clock)
    3. 4.3 External Clock Output (CLK_OUT)
    4. 4.4 Frequency Clock Counter (FCC)
  8. 5 Debugger
    1. 5.1 Debug Port Pins and Pinout
    2. 5.2 Debug Port Connection With Standard JTAG Connector
      1. 5.2.1 Standard XDS110
      2. 5.2.2 Lite XDS110 (MSPM0 LaunchPad™ kit)
  9. 6 Key Analog Peripherals
    1. 6.1 ADC Design Considerations
    2. 6.2 COMP and DAC Design Considerations
  10. 7 Key Digital Peripherals
    1. 7.1 Timer Resources and Design Considerations
    2. 7.2 UART and LIN Resources and Design Considerations
    3. 7.3 I2C and SPI Design Considerations
  11. 8 GPIOs
    1. 8.1 GPIO Output Switching Speed and Load Capacitance
    2. 8.2 GPIO Current Sink and Source
    3. 8.3 Open-Drain GPIOs Enable 5V Communication Without a Level Shifter
    4. 8.4 Communicate With 1.8V Devices Without a Level Shifter
    5. 8.5 Unused Pins Connection
  12. 9 Layout Guides
    1. 9.1 Power Supply Layout
    2. 9.2 Considerations for Ground Layout
      1. 9.2.1 What is Ground Noise?
    3. 9.3 Traces, Vias, and Other PCB Components
    4. 9.4 How to Select Board Layers and Recommended Stack-up
  13. 10Bootloader
  14. 11Summary
  15. 12References
  16. 13Revision History

8.2 GPIO Current Sink and Source

Table 8-3 MSPM0C GPIO Absolute Maximum Ratings
MIN NOM MAX UNIT
VDD Supply voltage 1.62 3.6 V
CVDD Capacitor placed between VDD and VSS 10 μF
IVDD Current of VDD pin MSPM0C1103 and MSPM0C1104 -40℃ ≤ Ta ≤ 85℃ 80 mA
MSPM0C1105 and MSPM0C1106 -40℃ ≤ Tj ≤ 130℃ 100
-40℃ ≤ Tj ≤ 85℃ 80
IIO Current for SDIO pin 6 mA
Current for ODIO pin 20 mA
TA Ambient temperature, S version –40 125 °C
TJ Max junction temperature, S version 130 °C
fMCLK MCLK, CPUCLK, ULPCLK frequency MSPM0C1103 and MSPM0C1104 with 0 flash wait states 24 MHz
MSPM0C1105 and MSPM0C1106 with 0 flash wait states 24
with 1 flash wait state 32
Note:
  • The total current of I/O must be less than the maximum value of IVDD.
  • ODIO are patched in a fixed pin; refer to the device data sheet.

SDIO can sink or source a maximum current of 6 mA (typical), which is sufficient to drive a typical LED. The total combined current must be less than IVDD.