SLAAET6 August   2025

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1S-Parameter Definition
    1. 1.1 Insertion Loss (S21)
    2. 1.2 Return Loss (S11)
  5. 2High-Speed Signal Design Example Of FPD-Link™ Serializer Body
    1. 2.1 Design Example Overview
    2. 2.2 Key Points in High-Speed FPD-Link Layout Design
  6. 3Factors Impacting Return Loss and Optimization Guidelines
    1. 3.1 Transmission Line Impedance Impact
    2. 3.2 AC Coupling Capacitor Landing Pad Impact And Optimization
      1. 3.2.1 Mitigation Strategy: Anti-Pad Implementation
      2. 3.2.2 Simulation Results With Ansys® HFSS
    3. 3.3 Through-Hole Connector Footprint Impact and Optimization
      1. 3.3.1 Through-Hole Connector Via Anti-Pad Impact
        1. 3.3.1.1 Simulation Results With Ansys® HFSS
      2. 3.3.2 Surrounding Ground Vias Impact
        1. 3.3.2.1 Simulation Results (Surrounding Ground Vias Impact)
      3. 3.3.3 Non-Functional Pad Impact
        1. 3.3.3.1 Simulation Results (Non-Functional Pad Impact)
    4. 3.4 Generic Signal Via Impact and Optimization
      1. 3.4.1 Simulation Results
    5. 3.5 ESD Diode Parasitic Capacitance Impact and Optimization
  7. 4Summary

3.3 Through-Hole Connector Footprint Impact and Optimization

The connector footprint is critical to minimize signal reflections to achieve good return loss performance. The designer is strongly recommended to simulate the connector footprint based on the board stackup.