SLIB006A February   2011  – June 2021 TPS81256 , TPS82084 , TPS82085 , TPS82130 , TPS82140 , TPS82150 , TPS82670 , TPS82671 , TPS826711 , TPS826716 , TPS82672 , TPS826721 , TPS82673 , TPS82674 , TPS826745 , TPS82675 , TPS82676 , TPS826765 , TPS82677 , TPS8268090 , TPS8268105 , TPS8268120 , TPS8268150 , TPS8268180 , TPS82692 , TPS82693 , TPS82695 , TPS826951 , TPS82697 , TPS82698 , TPS82740A , TPS82740B , TPSM82810 , TPSM82813 , TPSM82816 , TPSM82821 , TPSM82821A , TPSM82822 , TPSM82822A , TPSM82823 , TPSM82823A

 

  1. 1Introduction
  2. 2 MicroSiP Package
  3. 3PCB Layout
    1. 3.1 MicroSiP With BGA Pins
    2. 3.2 MicroSiL With LGA Pins
  4. 4Surface Mount Assembly
  5. 5Rework Guidelines
  6. 6FAQs
  7. 7Trademarks

3.2 MicroSiL With LGA Pins

When designing the pads for the MicroSiL devices with LGA pins, SMD pads are usually recommended over NSMD pads. With a power module, some pins (such as VIN, VOUT, and GND) are typically connected to large copper planes to carry the current and heat away from the device. Such copper planes grow the pad size of a NSMD pad, which then thins the solder paste thickness. Using SMD pads keeps each pad the same size and avoids solder pulling the device during reflow. See the device data sheet for specific recommendations.