Very Low Power: Channel-to-channel isolated modules use as many isolators as there are input channels. Usually isolators are among the more power-hungry devices on the board. As module profiles shrink, and many modules are packed close to each other, the air flow is limited, resulting in a higher temperature rise for the same amount of heat dissipated. To reduce overall power consumption in the system, and for thermal considerations, each isolator must consume very low power. On the other hand, since the digital isolator supports only one analog channel, the requirements on high-data rate and low-propagation delay are not as stringent as for group isolated designs.

Small footprint: Channel density and small form factor of the isolator are even more important than in the case of group isolated modules, due to the large number of isolators used.

Electromagnetic Compatibility (EMC): In group isolated modules, X or Y capacitors are sometimes used across the isolation barrier to reduce emissions and improve transient immunity _[1]. Channel-to-channel isolated analog input modules can ill afford an X capacitor for every channel due to space constraints. Hence it is imperative for the isolator used to be able to meet level 3 EMC according to IEC 61000-4-x and CISPR standards.