SLLSEB1F February   2012  – October 2021 TPD1E10B06

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings—JEDEC Specification
    3. 6.3 ESD Ratings—IEC Specification
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

4 Revision History

Changes from Revision E (June 2021) to Revision F (October 2021)

  • Updated the Application Schematic figureGo
  • Updated the Description of Pin 1 and pin 2 in the Pin Configuration and Functions sectionGo
  •  Changed HBM spec to per JS-001Go
  • Changed CDM spec to per JESD22-C101 Go
  • Changed HBM spec to Q101-001Go
  • Changed CDM spec to Q101-005 Go
  • Updated the Typical Application Schematic figureGo
  • Changed the system-level ESD protection from: ±20 kV Contact/± 25 kV Air-Gap to: ±8 kV Contact/± 15 kV Air-Gap Go

Changes from Revision D (Novemeber 2015) to Revision E (June 2021)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Added the DYA packageGo
  • Updated the Features sectionGo
  • Updated the Applications sectionGo
  • Updated the Description sectionGo
  • Added Thermal information for DYA packageGo
  • Updated the Overview sectionGo
  • Updated the Functional Block Diagram sectionGo
  • Updated the Feature Description sectionGo

Changes from Revision C (April 2015) to Revision D (November 2015)

  • Added  frequency test condition to capacitance specificationGo

Changes from Revision B (October 2012) to Revision C (April 2015)

  • Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go

Changes from Revision A (March 2012) to Revision B (October 2012)

  • Added THERMAL INFORMATION tableGo

Changes from Revision * (February 2011) to Revision A (March 2012)

  • Updated FEATURES.Go
  • Added graphs to TYPICAL CHARACTERISTICS section.Go
  • Added APPLICATION INFORMATION section.Go