SLLSEV6C July   2017  – February 2021 TIOS101 , TIOS1013 , TIOS1015

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1  Current Limit Configuration
      2. 8.3.2  Current Fault Detection, Indication and Auto Recovery
      3. 8.3.3  Thermal Warning, Thermal Shutdown
      4. 8.3.4  Fault Reporting (NFAULT)
      5. 8.3.5  Device Function Tables
      6. 8.3.6  The Integrated Voltage Regulator (LDO)
      7. 8.3.7  Reverse Polarity Protection
      8. 8.3.8  Integrated Surge Protection and Transient Waveform Tolerance
      9. 8.3.9  Power Up Sequence
      10. 8.3.10 Undervoltage Lock-Out (UVLO)
    4. 8.4 Device Functional Modes
      1. 8.4.1 NPN Configuration (N-Switch Mode)
      2. 8.4.2 PNP Configuration (P-Switch Mode)
      3. 8.4.3 Push-Pull Mode
  9. 9 Application Information Disclaimer
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Maximum Junction Temperature Check
        2. 9.2.2.2 Driving Capacitive Loads
        3. 9.2.2.3 Driving Inductive Loads
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary

9.2.2.1 Maximum Junction Temperature Check

For a 200 mA current limit:

  • The maximum driver output current limit, IO(LIM) = 250 mA (allowed for current limit tolerance).
  • The maximum voltage drop across the high-side switch is given with VDS(ON) = 1.75 V.

This causes a power consumption of:

Equation 1. GUID-27ABDEAD-2CA9-45D3-A3DE-E24A93E7A4F4-low.gif

For a 5 mA LDO current output,

Equation 2. GUID-01169AF6-3150-4E46-A9FB-65F50389F076-low.gif

Total power dissipation,

Equation 3. GUID-03E0E566-C233-4A13-8271-B48E48BFA2AB-low.gif

Multiply this value with the Junction-to-ambient thermal resistance of θJA = 68.1°C/W (taken from the Section 6.4 table) to receive the difference between junction temperature, TJ, and ambient temperature, TA:

Equation 4. GUID-D6BF7A42-B78E-4621-822E-C8296BFB7EFD-low.gif

Add this value to the maximum ambient temperature of TA = 105°C to receive the final junction temperature:

Equation 5. GUID-A0A2E4BA-2DB4-4FB4-914A-B8041BCA446C-low.gif

As long as TJ-max is below the recommended maximum value of 150°C, no thermal shutdown will occur. However, thermal warning may occur as the junction temperature is greater than TWRN.

Note that the modeling of the complete system may be necessary to predict junction temperature in smaller PCBs and/or enclosures without air flow.