SLLU312A July   2019  – May 2022 TCAN4550-Q1

 

  1.   TCAN4550-Q1 Functional Safety-Manual
  2.   Trademarks
  3. 1Introduction
  4. 2Product Functional Safety-Capability
  5. 3Product Overview
    1. 3.1 Block Diagram
    2. 3.2 Target Applications
      1. 3.2.1 Diagnostic Features
        1. 3.2.1.1 Mode Overview
        2. 3.2.1.2 Sleep Wake Error Timer (SWE)
        3. 3.2.1.3 Undervoltage
        4. 3.2.1.4 Thermal Shut Down
        5. 3.2.1.5 CAN Bus Communication
          1. 3.2.1.5.1 M_CAN
        6. 3.2.1.6 Processor Communication
          1. 3.2.1.6.1 SPI Integrity
            1. 3.2.1.6.1.1 SPI Scratchpad
            2. 3.2.1.6.1.2 SPIERR
            3. 3.2.1.6.1.3 M_CAN Forced Dominant and Recessive
            4. 3.2.1.6.1.4 SPI and FIFO
            5. 3.2.1.6.1.5 ECC for Memory
          2. 3.2.1.6.2 Timeout Watchdog
          3. 3.2.1.6.3 Floating Pins
          4. 3.2.1.6.4 RST Pin
          5. 3.2.1.6.5 Interrupt and Internal Fault Detection
  6. 4Development Process for Management of Systematic Faults
    1. 4.1 TI New-Product Development Process
  7. 5Revision History

3.2.1.4 Thermal Shut Down

The TCAN4550-Q1 has a temperature monitor located by two components that can cause thermal issues; VCCOUT LDO and CAN transceiver. This is a device protection mechanism. When TSD temperature is reached, the device enters the TSD protected state as shown in Figure 3-6. In this state, the VCCOUT LDO is turned off and the CAN transceiver is disabled. This helps mitigate bus communication fault, shown as 2, and VCCOUT issues, shown as 9, in Figure 3-5 and is considered safety mechanism SM-05. Undervoltage lock out prevents operation of the device and communication with the MCU and the CAN FD Bus when there is insufficient power on VSUP, VIO or VCCOUT.