SLUUC97B June   2020  – January 2025 UCC21222-Q1 , UCC21330-Q1

 

  1.   1
  2.   Trademarks
  3. 1Overview
  4. 2Functional Safety Failure In Time (FIT) Rates
  5. 3Failure Mode Distribution (FMD)
  6. 4Pin Failure Mode Analysis (Pin FMA)
  7. 5Revision History

Pin Failure Mode Analysis (Pin FMA)

This section provides a failure mode analysis (FMA) for the pins of the UCC21222-Q1 and UCC21330-Q1. The failure modes covered in this document include the typical pin-by-pin failure scenarios:

  • Pin short-circuited to ground (see Table 4-2)
  • Pin open-circuited (see Table 4-3)
  • Pin short-circuited to an adjacent pin (see Table 4-4)
  • Pin short-circuited to supply (see Table 4-5)

Table 4-2 through Table 4-5 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.

Table 4-1 TI Classification of Failure Effects
ClassFailure Effects
APotential device damage that affects functionality.
BNo device damage, but loss of functionality.
CNo device damage, but performance degradation.
DNo device damage, no impact to functionality or performance.

Figure 4-1 shows the UCC21222-Q1 and UCC21330-Q1 pin diagram. For a detailed description of the device pins please refer to the Pin Configuration and Functions section in the UCC21222-Q1 and UCC21330-Q1 data sheets.

UCC21222-Q1 UCC21330-Q1 Pin DiagramFigure 4-1 Pin Diagram

Following are the assumptions of use and the device configuration assumed for the pin FMA in this section:

  • Pins 1-8, short to VCCI is considered for short circuit to supply
  • Pins 13-16, short to VDDA is considered for short circuit to supply
  • Pins 9-12, short to VDDB is considered for short circuit to supply
  • GND is assumed to be a ground plane on the primary side
  • Pins 9-12, short to VSSB is considered for short circuit to ground
  • Pins 13-16, short to VSSA is considered for short circuit to ground
  • Corner pin adjacent pin short, short to inner pin is considered

Table 4-2 Pin FMA for Device Pins Short-Circuited to Ground
Pin Name Pin No. Description of Potential Failure Effects Failure Effect Class
INA 1 OUTA remains low. B
INB 2 OUTB remains low. B
VCCI 3 Device in reset. No positive power applied to device. B
GND 4 No effect. D
DIS 5 DIS function not available. B
DT 6 No dead time generated. B
NC 7 No effect. D
VCCI 8 Device in reset. No positive power applied to device. B
VSSB 9 No effect. D
OUTB 10 OUTB remains low. Possible damage to device. A
VDDB 11 OUTB remains low. B
NC 12 Possible isolation rating degradation. C
NC 13 Possible isolation rating degradation. C
VSSA 14 No effect. B
OUTA 15 OUTA remains low. Possible damage to device. A
VDDA 16 OUTA remains low. B
Table 4-3 Pin FMA for Device Pins Open-Circuited
Pin NamePin No.Description of Potential Failure EffectsFailure Effect Class
INA1OUTA remains low.B
INB2OUTB remains low.B
VCCI3No effect.D
GND4Device in reset. OUTA and OUTB do not respond to INA and INB.B
DIS5DIS function not available.B
DT6No dead time generated.B
NC7No effect.D
VCCI8No effect.D
VSSB9OUTB remains unknown.B
OUTB10OUTB disconnected from the system.B
VDDB11OUTB remains unknown.B
NC12No effect.D
NC13No effect.D
VSSA14OUTA remains unknown.B
OUTA15OUTA disconnected from the system.B
VDDA16OUTB remains unknown.B
Table 4-4 Pin FMA for Device Pins Short-Circuited to Adjacent Pin
Pin NamePin No.Shorted to (Pin No. + 1)Description of Potential Failure EffectsFailure Effect Class
INA1INBINA and INB input level can be unknown.B
INB2VCCIOUTB remains high.B
VCCI3GNDDevice in reset.B
GND4DISDIS function not available.B
DIS5DTNo dead time generated.B
DT6NCNo effect.D
NC7VCCINo effect.D
VCCI8N/AN/AD
VSSB9OUTBOUTB remains low. Device can be damaged.A
OUTB10VDDBOUTB remains high. Device can be damaged.A
VDDB11NCPossible isolation rating degradation.C
NC12NCPossible isolation rating degradation.C
NC13VSSAPossible isolation rating degradation.C
VSSA14OUTAOUTA remains low. Device can be damaged.A
OUTA15VDDAOUTA remains high. Device can be damaged.A
VDDA16N/AN/AD
Table 4-5 Pin FMA for Device Pins Short-Circuited to Supply
Pin NamePin No.Description of Potential Failure EffectsFailure Effect Class
INA1OUTA remains high.B
INB2OUTB remains high.B
VCCI3No effect.D
GND4Device in reset.B
DIS5OUTA and OUTB remains low.B
DT6No dead time generated.B
NC7No effect.D
VCCI8No effect.D
VSSB9OUTB remains low.B
OUTB10OUTB remains high. Device can be damaged.A
VDDB11No effect.B
NC12Possible isolation rating degradation.B
NC13Possible isolation rating degradation.B
VSSA14OUTA remains low.B
OUTA15OUTA remains high. Device can be damaged.A
VDDA16No effect.D