SLVS044Z September   1997  – April 2025 LM317

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information (Legacy Chip)
    5. 6.5 Thermal Information (New Chip)
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 NPN Darlington Output Drive
      2. 7.3.2 Overload Block
      3. 7.3.3 Programmable Feedback
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Operation With Low Input Voltage
      3. 7.4.3 Operation at Light Loads
      4. 7.4.4 Operation In Self Protection
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 System Examples
      1. 8.3.1  0V to 30V Regulator Circuit
      2. 8.3.2  Adjustable Regulator Circuit With Improved Ripple Rejection
      3. 8.3.3  Precision Current-Limiter Circuit
      4. 8.3.4  Tracking Preregulator Circuit
      5. 8.3.5  1.25V to 20V Regulator Circuit With Minimum Program Current
      6. 8.3.6  Battery-Charger Circuit
      7. 8.3.7  50mA, Constant-Current, Battery-Charger Circuit
      8. 8.3.8  Slow Turn-On 15V Regulator Circuit
      9. 8.3.9  AC Voltage-Regulator Circuit
      10. 8.3.10 Current-Limited 6V Charger Circuit
      11. 8.3.11 Adjustable 4A Regulator Circuit
      12. 8.3.12 High-Current Adjustable Regulator Circuit
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
        1. 8.5.1.1 Thermal Considerations
          1. 8.5.1.1.1 Heat Sink Requirements
          2. 8.5.1.1.2 Heat Sinking Surface-Mount Packages
            1. 8.5.1.1.2.1 Heatsinking the SOT-223 (DCY) Package
            2. 8.5.1.1.2.2 Heat Sinking the TO-263 (KTT) Package
      2. 8.5.2 Layout Examples
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Device Nomenclature
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
Power dissipation Internally limited
Input-output voltage differential −0.3 40 V
Storage temperature, Tstg −65 150 °C
Operating virtual junction temperature, TJ (legacy chip) −65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications.