SLVS348N July   2001  – January 2025 TPS793

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagrams
    3. 6.3 Feature Description
      1. 6.3.1 Undervoltage Lockout (UVLO)
      2. 6.3.2 Shutdown
      3. 6.3.3 Active Discharge (new chip)
      4. 6.3.4 Foldback Current Limit
      5. 6.3.5 Thermal Protection
      6. 6.3.6 Reverse Current
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
      3. 6.4.3 Disabled
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Adjustable Operation
      2. 7.1.2 Exiting Dropout
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Capacitor Recommendations
        2. 7.2.2.2 Input and Output Capacitor Requirements
        3. 7.2.2.3 Noise Reduction and Feed-Forward Capacitor Requirements
      3. 7.2.3 Application Curves
    3. 7.3 Best Design Practices
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
        1. 7.5.1.1 Board Layout Recommendations to Improve PSRR and Noise Performance
        2. 7.5.1.2 Power Dissipation
      2. 7.5.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 Evaluation Modules
        2. 8.1.1.2 Spice Models
      2. 8.1.2 Device Nomenclature
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) TPS793 UNIT
DBV (SOT23-6) YZQ (DSBGA) DBV (SOT23-6)(2) DBV (SOT23-5)(2)
6 PINS 5 PINS 6 PINS 5 PINS
RθJA Junction-to-ambient thermal resistance 225.1 178.5 171.7 182.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 78.4 1.4 110.8 114.8 °C/W
RθJB Junction-to-board thermal resistance 54.7 62.1 85.4 79.1 °C/W
ψJT Junction-to-top characterization parameter 3.3 0.9 54.4 56.8 °C/W
ψJB Junction-to-board characterization parameter 53.8 62.1 85.2 78.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Packaging application note.
(2) New Chip.