SLVSDC7F April   2017  – February 2022 DRV5032

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Magnetic Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Magnetic Flux Direction
      2. 8.3.2 Device Version Comparison
        1. 8.3.2.1 Magnetic Threshold
        2. 8.3.2.2 Magnetic Response
        3. 8.3.2.3 Output Type
        4. 8.3.2.4 Sampling Rate
      3. 8.3.3 Hall Element Location
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Output Type Tradeoffs
    2. 9.2 Typical Applications
      1. 9.2.1 General-Purpose Magnet Sensing
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Three-Position Switch
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curve
    3. 9.3 Do's and Don'ts
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

7.4 Thermal Information

THERMAL METRIC(1)DRV5032UNIT
DBZ (SOT-23)DMR (X2SON)LPG (TO-92)
3 PINS4 PINS3 PINS
RθJAJunction-to-ambient thermal resistance356159183.1°C/W
RθJC(top)Junction-to-case (top) thermal resistance1287774.2°C/W
RθJBJunction-to-board thermal resistance94102158.8°C/W
ψJTJunction-to-top characterization parameter11.40.915.2°C/W
ψJBJunction-to-board characterization parameter92100158.8°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.