SLVSEI1C June   2019  – October 2020 TPS62864 , TPS62866

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Options
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 I2C InterfaceTiming Characteristics
    7. 7.7 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power Save Mode
      2. 8.3.2 Forced PWM Mode
      3. 8.3.3 Start-up
      4. 8.3.4 Switch Current Limit and HICCUP Short-Circuit Protection
      5. 8.3.5 Undervoltage Lockout (UVLO)
      6. 8.3.6 Thermal Warning and Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Enable and Disable (EN)
      2. 8.4.2 Output Discharge
      3. 8.4.3 Start-up Output Voltage and I2C Slave Address Selection (VSET)
      4. 8.4.4 Select Output Voltage Registers (VID)
      5. 8.4.5 Power Good (PG)
    5. 8.5 Programming
      1. 8.5.1 Serial Interface Description
      2. 8.5.2 Standard-, Fast-, and Fast-Mode Plus Protocol
      3. 8.5.3 HS-Mode Protocol
      4. 8.5.4 I2C Update Sequence
      5. 8.5.5 I2C Register Reset
    6. 8.6 Register Map
      1. 8.6.1 Slave Address Byte
      2. 8.6.2 Register Address Byte
      3. 8.6.3 VOUT Register 1
      4. 8.6.4 VOUT Register 2
      5. 8.6.5 CONTROL Register
      6. 8.6.6 STATUS Register
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 6-A Output Current Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Custom Design With WEBENCH® Tools
          2. 9.2.1.2.2 Setting The Output Voltage
          3. 9.2.1.2.3 Output Filter Design
          4. 9.2.1.2.4 Inductor Selection
          5. 9.2.1.2.5 Capacitor Selection
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Smaller Application Solution
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Support Resources
    4. 12.4 Receiving Notification of Documentation Updates
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

IMPORTANT NOTICE AND DISCLAIMER

TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources.
TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2020, Texas Instruments Incorporated