SLVSH61C March   2025  – November 2025 TPS7H4102-SEP , TPS7H4104-SEP

PRODMIX  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Quality Conformance Inspection
    7. 6.7 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 VIN and Power VIN Pins (VIN and PVIN)
      2. 8.3.2 Voltage Reference
      3. 8.3.3 Setting VOUTx
        1. 8.3.3.1 VOUTx with Error
        2. 8.3.3.2 Minimum Output Voltage
        3. 8.3.3.3 Maximum Output Voltage
      4. 8.3.4 Enable and EN_SEQ
        1. 8.3.4.1 ENx and External UVLO
        2. 8.3.4.2 Sequence UP/DOWN (EN_SEQ)
      5. 8.3.5 Power Good (PWRGDx)
      6. 8.3.6 Adjustable Switching Frequency, Synchronization (SYNC) and Relative Phase Shift
        1. 8.3.6.1 Internal Clock Mode
        2. 8.3.6.2 External Clock Mode and Switchover
        3. 8.3.6.3 Relative Phase Shift
      7. 8.3.7 Turn-On Behavior
        1. 8.3.7.1 Pulse Skipping During Start-up
        2. 8.3.7.2 Soft-Start (SS_TRx)
        3. 8.3.7.3 Safe Start-up Into Pre-biased Outputs
        4. 8.3.7.4 Tracking and Sequencing (SS_TRx)
      8. 8.3.8 Protection Modes
        1. 8.3.8.1 Overcurrent Protection
          1. 8.3.8.1.1 High-Side Cycle by Cycle Overcurrent Protection (IOC_HSx)
          2. 8.3.8.1.2 Low-Side Sourcing Overcurrent Protection (IOC_LS_SOURCINGx)
          3. 8.3.8.1.3 COMPx Clamp Shutdown (COMPxCLAMP)
          4. 8.3.8.1.4 Low-Side Overcurrent Sourcing and Sinking Protection
        2. 8.3.8.2 Output Overvoltage Protection (OVP)
        3. 8.3.8.3 Thermal Shutdown
      9. 8.3.9 Error Amplifier and Loop Response
        1. 8.3.9.1 Error Amplifier
        2. 8.3.9.2 Power Stage Transconductance
        3. 8.3.9.3 Slope Compensation
        4. 8.3.9.4 Frequency Compensation
    4. 8.4 Device Functional Modes
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Operating Frequency
        2. 9.2.2.2 Output Inductor Selection
        3. 9.2.2.3 Output Capacitor Selection
        4. 9.2.2.4 Input Capacitor Selection
        5. 9.2.2.5 Soft-Start Capacitor Selection
        6. 9.2.2.6 Undervoltage Lockout (UVLO) Set Point
        7. 9.2.2.7 Output Voltage Feedback Resistor Selection
        8. 9.2.2.8 Slope Compensation Requirements
        9. 9.2.2.9 Compensation Component Selection
      3. 9.2.3 Application Curves
    3. 9.3 Parallel Operation
      1. 9.3.1 Input and Output Capacitance Reduction
        1. 9.3.1.1 Output Capacitance Reduction
        2. 9.3.1.2 Input Capacitance Reduction
    4. 9.4 Termination Guidelines for Unused Channels
    5. 9.5 Power Supply Recommendations
    6. 9.6 Layout
      1. 9.6.1 Layout Guidelines
      2. 9.6.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Output Voltage Feedback Resistor Selection

The resistor divider network RFB_TOPx and RFB_BOTx is used to set the output voltage. For this design, 10kΩ was selected for RFB_TOPx. Additionally, a 20Ω resistor was placed in series with RFB_TOPx to aid in measuring the control loop. Using the combined value of 10.02kΩ and using Equation 1 the bottom resistors are calculated. The real (or selected) resistors were chosen, using the closest value to the calculation (using 0.1% tolerance). To minimize the error due to the reference voltage (VREFx), the center across temperature, rather than the typical value is used for the calculations as presented on Equation 21.

Using the real (or selected) values the expected nominal and error are calculated using Equation 3 and Equation 4. The results are presented on Table 9-8.

Table 9-8 Feedback Resistors and Expected VOUTx with Error
VOUTx (V) CALCULATED RFB_BOTx (kΩ) SELECTED RFB_BOTx (kΩ) VOUTx REAL (V) VOUTx ERROR (mV)
0.8 29.57 29.4 0.802 8.02
1.2 9.94 9.88 1.204 12.07
1.5 6.63 6.57 1.509 15.15
1.8 4.98 4.93 1.812 18.2

Lifetime drift data can similarly be added. Group C data can be used to aid in this calculation. For this example, assume the lifetime drift is minimal compared to the other sources of error and is therefore not added.