SLVUC32B June   2021  – February 2022 DRA829V , TDA4VM , TDA4VM-Q1 , TPS6594-Q1

 

  1.   Trademarks
  2. 1Introduction
  3. 2Device Versions
  4. 3Processor Connections
    1. 3.1 Power Mapping
    2. 3.2 Control Mapping
  5. 4Supporting Functional Safety Systems
    1. 4.1 Achieving ASIL-B System Requirements
    2. 4.2 Achieving up to ASIL-D System Requirements
  6. 5Static NVM Settings
    1. 5.1  Application-Based Configuration Settings
    2. 5.2  Device Identification Settings
    3. 5.3  BUCK Settings
    4. 5.4  LDO Settings
    5. 5.5  VCCA Settings
    6. 5.6  GPIO Settings
    7. 5.7  Finite State Machine (FSM) Settings
    8. 5.8  Interrupt Settings
    9. 5.9  POWERGOOD Settings
    10. 5.10 Miscellaneous Settings
    11. 5.11 Interface Settings
    12. 5.12 Multi-Device Settings
    13. 5.13 Watchdog Settings
  7. 6Pre-Configurable Finite State Machine (PFSM) Settings
    1. 6.1 Configured States
    2. 6.2 PFSM Triggers
    3. 6.3 Power Sequences
      1. 6.3.1 TO_SAFE_SEVERE and TO_SAFE
      2. 6.3.2 TO_SAFE_ORDERLY and TO_STANDBY
      3. 6.3.3 ACTIVE_TO_WARM
      4. 6.3.4 ESM_SOC_ERROR
      5. 6.3.5 PWR_SOC_ERROR
      6. 6.3.6 MCU_TO_WARM
      7. 6.3.7 TO_MCU
      8. 6.3.8 TO_ACTIVE
      9. 6.3.9 To Suspend-to-RAM (TO_S2R)
  8. 7Impact of NVM Changes
  9. 8References
  10. 9Revision History

Power Mapping

Figure 3-1 shows the power mapping between the dual TPS6594-Q1 PMIC power resources and processor voltage domains required to support independent MCU and Main power rails. In this configuration, both PMICs use a 3.3 V input voltage. For Functional Safety applications, there is a protection FET before VCCA that connects to the OVPGDRV pin of the primary PMIC, allowing voltage monitoring of the input supply to the PMICs.

The VCCA voltage must be the first voltage applied to the PMIC devices. VIO_IN of the PMICs must not be supplied before VCCA. A load switch supplies VIO_IN in this PDN. This load switch also supplies the VDDSHVx_MCU voltage domain of the processor. This allows PMIC GPIO control signals referenced to VIO_IN to remain active during MCU Only low power mode and to be disabled during DDR Retention (aka Suspend-to-RAM) to reduce PMIC power.

For SD card dual-voltage I/O support (3.3 V and 1.8 V), LDO1 of the TPS659411-Q1 device can be used. A processor GPIO control signal with a logic high default value is used to set SD VIO to 3.3 V initially. During processor power up, the boot loader SW can set GPIO signal low to select 1.8 V level as needed for high-speed card operation per SD specification. This allows control of the LDO1 voltage without the need for the MCU processor to establish I2C communication with the PMICs during boot from SD card operations.

This PDN uses four discrete power components with three being required and one is optional depending upon end product features. The two TPS22965-Q1 Load Switches connect VCCA_3V3 power rail to supply OV protected 3.3 V to processor I/O domains. Two load switches are required in order to enable isolation between MCU and Main processor sub-sections for MCU Safety Island or MCU Only low power operations. The TPS62813-Q1 Buck Converter supplies LPDDR4 SDRAM component with required 1.1V supply. The unused primary PMIC FB pin, FB_B3, has been configured per NVM settings, Table 5-3, to provide voltage monitoring for VDD_DDR_1V1 power rail if an end product OV/UV monitoring requirements include this supply. The one optional discrete power component is TLV73318-Q1 LDO that can be used if an end product uses a high security processor type and desires the capability to program Efuse values on-board. If this feature is not desired, then this LDO can be omitted and processor VPP pins treated per data manual recommendations.

Note: The PMIC voltage monitor on FB_B3 must be connected to 1.1 V. The VMON_ABIST_EN=1 for both the primary and secondary PMICs. If 1.1 V is not connected to FB_B3 when the monitor is enabled then the self-test fails and the BIST_FAIL_INT interrupt is set and the device goes to the safe state and main processor voltages are disabled.
GUID-20210615-CA0I-ZRMZ-VS9W-JGS4W2TM4H5K-low.gif Figure 3-1 Power Connections

  • * VDD_CPU_AVS, boot voltage of 0.8 V then software sets device specific AVS; 0.68 V – 0.72 V.
  • ** VDD_SD_DV, 3.3 V then software changes to 1.8 V per HS-SD.

Table 3-1 identifies which power resources are required to support different system features. If the system feature listed is not required, the power resource connection can be removed and the processor voltage domains need to be grouped into alternative power rails.

Table 3-1 PDN Power Mapping and System Features
Power Mapping System Features
Device Power Resource Power Rails Processor and Memory Domains Active SoC MCU - only Suspend-to-RAM SD Card USB Interface
TPS65941212-Q1 BUCK123 VDD_CPU_AVS VDD_CPU Required
FB_B3 VDDS_DDR_BIAS, VDDS_DDR_IO, LPDDR4 Required Required
BUCK4 VDD_MCU_0V85 VDDAR_MCU, VDD_MCU Required Required
BUCK5 VDD_PHY_1V8 VDDA_1P8_PHYs Required
LDO1 VDD1_DDR_1V8 Mem: VDD1 Required Optional Required
LDO2 VDD_MCUIO_1V8 VDDSHVx_MCU (1.8 V) Required Required
Mem: VCC
LDO3 VDA_DLL_0V8 VDDA_0P8_PLLs/DLLs Required
LDO4 VDA_MCU_1V8 VDDA_x Required Required
TPS65941111-Q1 BUCK1234 VDD_CORE_0V8 VDD_CORE, VDDA_0P8_PHYs Required
BUCK5 VDD_RAM_0V85 VDDAR_CPU/CORE Required
LDO1 VDD_SD_DV VDDSHV5 Required
LDO2 VDD_USB_3V3 VDDA_3P3_USB Required
LDO3 VDD_IO_1V8 VDDS_MMC0 Required
Mem: VCCQ
LDO4 VDA_PLL_1V8 VDDA_1P8_PLLs Required
TPS22965-Q1 Load Switch VDD_MCUIO_3V3 VDDSHVx_MCU (3.3 V) Required Required
TPS22965-Q1 Load Switch VDD_IO_3V3 VDDSHV0-4,VDDSHV6 (3.3 V) Required Required
TLV73318P-Q1 LDO VPP_EFUSE_1V8 VPP_x(EFUSE) Optional
TPS62813-Q1 BUCK VDD_DDR_1V1 VDDS_DDR_BIAS, VDDS_DDR_IO Required Optional Required
Mem: VDD2