SLVUC32B June   2021  – February 2022 DRA829V , TDA4VM , TDA4VM-Q1 , TPS6594-Q1

 

  1.   Trademarks
  2. 1Introduction
  3. 2Device Versions
  4. 3Processor Connections
    1. 3.1 Power Mapping
    2. 3.2 Control Mapping
  5. 4Supporting Functional Safety Systems
    1. 4.1 Achieving ASIL-B System Requirements
    2. 4.2 Achieving up to ASIL-D System Requirements
  6. 5Static NVM Settings
    1. 5.1  Application-Based Configuration Settings
    2. 5.2  Device Identification Settings
    3. 5.3  BUCK Settings
    4. 5.4  LDO Settings
    5. 5.5  VCCA Settings
    6. 5.6  GPIO Settings
    7. 5.7  Finite State Machine (FSM) Settings
    8. 5.8  Interrupt Settings
    9. 5.9  POWERGOOD Settings
    10. 5.10 Miscellaneous Settings
    11. 5.11 Interface Settings
    12. 5.12 Multi-Device Settings
    13. 5.13 Watchdog Settings
  7. 6Pre-Configurable Finite State Machine (PFSM) Settings
    1. 6.1 Configured States
    2. 6.2 PFSM Triggers
    3. 6.3 Power Sequences
      1. 6.3.1 TO_SAFE_SEVERE and TO_SAFE
      2. 6.3.2 TO_SAFE_ORDERLY and TO_STANDBY
      3. 6.3.3 ACTIVE_TO_WARM
      4. 6.3.4 ESM_SOC_ERROR
      5. 6.3.5 PWR_SOC_ERROR
      6. 6.3.6 MCU_TO_WARM
      7. 6.3.7 TO_MCU
      8. 6.3.8 TO_ACTIVE
      9. 6.3.9 To Suspend-to-RAM (TO_S2R)
  8. 7Impact of NVM Changes
  9. 8References
  10. 9Revision History

1 Introduction

This user’s guide describes a power distribution network (PDN), PDN-0B, between two TPS6594-Q1 devices and either DRA829V or TDA4VM processor with independent MCU and Main power rails. This PDN enables board level isolation of the processor MCU and Main voltage resources as required to leverage the processor architecture in implementing two desirable end product features:

  1. MCU processor acts as independent safety monitor (MCU Safety Island) over the Main processing resources to ensure safe system operations.
  2. MCU processor maintains minimum system operations (MCU Only) to significantly reduce processor power dissipation thereby extending battery life during stand-by use cases and reducing component temperature.

This description includes the following to clarify platform system operation:

  1. PDN power resource connections
  2. PDN digital control connections
  3. Primary and secondary PMIC default NVM contents
  4. PMIC sequencing settings to support different PDN power state transitions for an advanced processor system
PMIC and processor data manuals describe recommended operation, electrical characteristics, external components, package details, register maps, and overall component functionality. In the event of any inconsistency between any user's guide, application report, or other referenced material, the data sheet specification is the definitive source.