SNIS244 September   2025 ISOTMP35R

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Insulation Specification
    6. 5.6  Power Ratings
    7. 5.7  Safety-Related Certifications
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics
    10. 5.10 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Features Description
      1. 6.3.1 Integrated Isolation Barrier and Thermal Response
      2. 6.3.2 Analog Output
        1. 6.3.2.1 Output Accuracy
        2. 6.3.2.2 Drive Capability
        3. 6.3.2.3 Common Mode Transient Immunity (CMTI)
      3. 6.3.3 Thermal Response
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 External Buffer
      2. 7.1.2 ADC Interface Considerations
      3. 7.1.3 Electromagnetic Noise Mitigation
        1. 7.1.3.1 Filtering Techniques
        2. 7.1.3.2 General Design Guidelines
        3. 7.1.3.3 PCB Layout Practices
      4. 7.1.4 Insulation Lifetime
    2. 7.2 Power Supply Recommendations
      1. 7.2.1 PSRR Considerations
    3. 7.3 Layout
      1. 7.3.1 Layout Guidelines
      2. 7.3.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

7.1.3.1 Filtering Techniques

EMI mitigation begins at the schematic level. TI recommends using RC filters or Pi filters on ISOTMP35R traces to attenuate coupled noise. In addition, ferrite beads on VDD and GND help suppress high-frequency noise before the noise couples into the device.

Place filtering components both at the ISOTMP35R pins and at the signal termination point. For example, placing an RC filter only near the device leaves the rest of the trace vulnerable to noise pickup. Figure 7-3 illustrates an example filter configuration for reducing EMI effects.

ISOTMP35R Example Filtering for EMI Mitigation Figure 7-3 Example Filtering for EMI Mitigation