SNOA930C March   2015  – May 2021 LDC0851 , LDC1001 , LDC1001-Q1 , LDC1041 , LDC1051 , LDC1101 , LDC1312 , LDC1312-Q1 , LDC1314 , LDC1314-Q1 , LDC1612 , LDC1612-Q1 , LDC1614 , LDC1614-Q1 , LDC2112 , LDC2114 , LDC3114 , LDC3114-Q1

 

  1.   Trademarks
  2. 1The Sensor
    1. 1.1 Sensor Frequency
    2. 1.2 RS and RP
      1. 1.2.1 AC Resistance
      2. 1.2.2 Skin Effect
  3. 2Inductor Characteristics
    1. 2.1 Inductor Shape
      1. 2.1.1 Example Uses of Different Inductor Shapes
    2. 2.2 Number of Turns
    3. 2.3 Multiple Layers
      1. 2.3.1 Mutual Inductance of Coils in Series
      2. 2.3.2 Multi-Layer Parallel Inductor
      3. 2.3.3 Temperature Compensation
    4. 2.4 Inductor Size
    5. 2.5 Self-Resonance Frequency
      1. 2.5.1 Measurement of SRF
      2. 2.5.2 Techniques to Improve SRF for Wire-wound Inductors
  4. 3Capacitor Characteristics
    1. 3.1 Capacitor RS, Q, and SRF
    2. 3.2 Effect of Parasitic Capacitance
      1. 3.2.1 Recommended Capacitor Values
    3. 3.3 Capacitor Placement
  5. 4Physical Coil Design
    1. 4.1 Example Design Procedure Using WEBENCH
      1. 4.1.1 General Design Sequence
    2. 4.2 PCB Layout Recommendations
      1. 4.2.1 Minimize Conductors Near Sensor
      2. 4.2.2 Sensor Vias and Other Techniques for PCBs
  6. 5Summary
  7. 6References
  8. 7Revision History

3.3 Capacitor Placement

For the LDC1101, LDC131x, and LDC161x devices, it is recommended to place the capacitor physically as close as possible to the inductor to minimize the parasitic RS due to the traces between the inductor and capacitor. For the LDC0851, LDC211x and LDC3114 devices, the sensor capacitor must be placed as close as possible to the appropriate device pin.