SNOS469K April   2000  – January 2017 LM8261

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
    7. 5.7 Old Versus New Die Comparison
  7. 6Application and Implementation
    1. 6.1 Driving Capacitive Loads
    2. 6.2 Low-Side Current Measurement
    3. 6.3 Output Short Circuit Current and Dissipation Issues
    4. 6.4 Other Application Hints
    5. 6.5 Power Supply Recommendations
    6. 6.6 Layout
      1. 6.6.1 Layout Guidelines
  8. 7Device and Documentation Support
    1. 7.1 Documentation Support
      1. 7.1.1 Related Documentation
    2. 7.2 Receiving Notification of Documentation Updates
    3. 7.3 Support Resources
    4. 7.4 Trademarks
    5. 7.5 Electrostatic Discharge Caution
    6. 7.6 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

5.7 Old Versus New Die Comparison

As of the publication of revision K of this data sheet, Texas Instruments has moved manufacturing of the die for LM8261 to a modern fabrication site. The two different die are referred to in this document as “old” (previous fabrication site) and “new” die. The die origin can be separated from the “Chip Source Origin” (CSO) parameter in the shipping information. The old die CSO is “GF6”, for the new die the CSO is “RFB”. The old die information is in the shipping information. The old die CSO is “GF6”, for the new die the CSO is “RFB”. The old die information is maintained in this data sheet for comparison purposes, but all new manufacturing has moved to the new die.