SNOS469K April   2000  – January 2017 LM8261

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
    7. 5.7 Old Versus New Die Comparison
  7. 6Application and Implementation
    1. 6.1 Driving Capacitive Loads
    2. 6.2 Low-Side Current Measurement
    3. 6.3 Output Short Circuit Current and Dissipation Issues
    4. 6.4 Other Application Hints
    5. 6.5 Power Supply Recommendations
    6. 6.6 Layout
      1. 6.6.1 Layout Guidelines
  8. 7Device and Documentation Support
    1. 7.1 Documentation Support
      1. 7.1.1 Related Documentation
    2. 7.2 Receiving Notification of Documentation Updates
    3. 7.3 Support Resources
    4. 7.4 Trademarks
    5. 7.5 Electrostatic Discharge Caution
    6. 7.6 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC(1)(2)DBVUNIT
(5 PINS)
RθJAJunction-to-ambient thermal resistance185.4°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The maximum power dissipation is a function of TJ(max), RθJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) - TA)/ RθJA. All numbers apply for packages soldered directly onto a PC board.