SNOU176B October   2020  – March 2022

PRODUCTION DATA  

  1.   Trademarks
  2. 1 General TI High Voltage Evaluation User Safety Guidelines
    1. 1.1 Safety and Precautions
  3. 2 Introduction
    1. 2.1 LMG342XEVM-04X Daughter Card
      1. 2.1.1 FAULT and OC
      2. 2.1.2 Power Pins
      3. 2.1.3 Bootstrap Mode
      4. 2.1.4 Heat Sink
    2. 2.2 Mother Boards
      1. 2.2.1 Bias Supply
      2. 2.2.2 PWM Input
      3. 2.2.3 Fault Protection
    3. 2.3 Typical Applications
    4. 2.4 Features
  4. 3  LMG342XEVM-04X Schematic
  5. 4 Mother Board Schematic
  6. 5 Recommended Footprint
  7. 6 Test Equipment
  8. 7 Test Procedure When Paired With LMG342X-BB-EVM
    1. 7.1 Setup
    2. 7.2 Start-Up and Operating Procedure
    3. 7.3 Test Results
    4. 7.4 Shutdown Procedure
    5. 7.5 Additional Operating Notes
  9. 8 Test Procedure When Paired With LMG34XX-BB-EVM
    1. 8.1 Setup
      1. 8.1.1 List of Test Points
      2. 8.1.2 List of Terminals
    2. 8.2 Start-Up and Operating Procedure
    3. 8.3 Shutdown Procedure
    4. 8.4 Additional Operation Notes
  10. 9 Bill of Materials
  11. 10Revision History

2.1.1 FAULT and OC

The FAULT and OC pins of the LMG342XEVM-04X are active low when an undervoltage lockout occurs on an auxiliary voltage rail, when an overtemperature event occurs, or when an overcurrent/short-circuit event occurs on the LMG342XR0X0. The signals are level-shifted to AGND. Refer to the LMG342XR0X0 data sheet for operation details.

CAUTION:

Do NOT ignore a FAULT signal when using the LMG342XEVM-04X. Turn off both top and bottom devices if any device generates a FAULT signal. The device under a fault condition may operate in the undesired third-quadrant mode and can overheat or become damaged due to the high source-drain voltage drop if the other device is still switching.