SNVSB42A December   2017  – December 2025 LM25576-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Resistance Characteristics
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 High Voltage Start-Up Regulator
    4. 6.4 Device Functional Modes
      1. 6.4.1 Shutdown and Stand-by Mode
      2. 6.4.2 Oscillator and Sync Capability
      3. 6.4.3 Error Amplifier and PWM Comparator
      4. 6.4.4 RAMP Generator
      5. 6.4.5 Maximum Duty Cycle and Input Drop-Out Voltage
      6. 6.4.6 Current Limit
      7. 6.4.7 Soft-Start
      8. 6.4.8 Boost Pin
      9. 6.4.9 Thermal Protection
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Design Requirements
      2. 7.1.2 Detailed Design Procedure
        1. 7.1.2.1  R3 (RT)
        2. 7.1.2.2  Inductor (L1)
        3. 7.1.2.3  C3 (CRAMP)
        4. 7.1.2.4  C9, C10
        5. 7.1.2.5  D1
        6. 7.1.2.6  C1, C2
        7. 7.1.2.7  C8
        8. 7.1.2.8  C7
        9. 7.1.2.9  C4
        10. 7.1.2.10 R5, R6
        11. 7.1.2.11 R1, R2, C12
        12. 7.1.2.12 R7, C11
        13. 7.1.2.13 R4, C5, C6
      3. 7.1.3 Bias Power Dissipation Reduction
    2. 7.2 Typical Application
      1. 7.2.1 Typical Schematic for High Frequency (1MHz) Application
      2. 7.2.2 Typical Schematic for Buck and Boost (Inverting) Application
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 PCB Layout and Thermal Considerations
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Developmental Support
        1. 8.1.1.1 Custom Design With WEBENCH® Tools
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

5.4 Thermal Resistance Characteristics

THERMAL METRIC(1)

LM25576-Q1

UNIT

PWP (HTSSOP)

20 pins

R θJAJunction-to-ambient thermal resistance

40

°C/W
RθJC(top)Junction-to-case (top) thermal resistance

33.6

°C/W
R θJBJunction-to-board thermal resistance

6.9

°C/W
ψ JTJunction-to-top characterization parameter

1.3

°C/W
ψ JBJunction-to-board characterization parameter

14.8

°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.