SNVSBO7B July   2020  – May 2025 LM63610-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 System Characteristics
    9. 6.9 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 SYNC/MODE Selection
      2. 7.3.2 Output Voltage Selection
      3. 7.3.3 Switching Frequency Selection
        1. 7.3.3.1 Spread Spectrum Option
      4. 7.3.4 Enable and Start-up
      5. 7.3.5 RESET Flag Output
      6. 7.3.6 Undervoltage Lockout and Thermal Shutdown and Output Discharge
    4. 7.4 Device Functional Modes
      1. 7.4.1 Overview
      2. 7.4.2 Light Load Operation
        1. 7.4.2.1 Sync/FPWM Operation
      3. 7.4.3 Dropout Operation
      4. 7.4.4 Minimum On-time Operation
      5. 7.4.5 Current Limit and Short-Circuit Operation
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Choosing the Switching Frequency
        2. 8.2.2.2 Setting the Output Voltage
          1. 8.2.2.2.1 CFF Selection
        3. 8.2.2.3 Inductor Selection
        4. 8.2.2.4 Output Capacitor Selection
        5. 8.2.2.5 Input Capacitor Selection
        6. 8.2.2.6 CBOOT
        7. 8.2.2.7 VCC
        8. 8.2.2.8 External UVLO
        9. 8.2.2.9 Maximum Ambient Temperature
      3. 8.2.3 Application Curves
      4. 8.2.4 EMI Performance Curves
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
        1. 8.5.1.1 Ground and Thermal Considerations
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

8.2.2.5 Input Capacitor Selection

The ceramic input capacitors provide a low impedance source to the regulator in addition to supplying the ripple current and isolating switching noise from other circuits. A minimum of 4.7µF of ceramic capacitance is required on the input of the LM63610-Q1, connected directly between VIN and PGND. This must be rated for at least the maximum input voltage that the application requires; preferably twice the maximum input voltage. This capacitance can be increased to help reduce input voltage ripple and maintain the input voltage during load transients. More input capacitance is required for larger output currents. In addition, a small case size 220nF ceramic capacitor must be used at the input as close a possible to the regulator, typically within 1mm of the VIN and PGND pins. This provides a high frequency bypass for the control circuits internal to the device. For this example, a 4.7µF, 50V, X7R (or better) ceramic capacitor is chosen. The 220nF must also be rated at 50V with an X7R dielectric and preferably a small case size, such as an 0603.

Many times, it is desirable to use an electrolytic capacitor on the input in parallel with the ceramics. This is especially true if long leads or traces are used to connect the input supply to the regulator. The moderate ESR of this capacitor can help damp any ringing on the input supply caused by the long power leads. The use of this additional capacitor also helps with voltage dips caused by input supplies with unusually high impedance.

Most of the input switching current passes through the ceramic input capacitor or capacitors. Use Equation 10 to calculate the approximate RMS current. This value must be checked against the manufacturers' maximum ratings.

Equation 10. I R M S ≅ I O U T 2

The input capacitor is part of the buck converter high di/dt current loop. The high di/dt current, together with excessive parasitic inductance between the IC and the input capacitor, can result in excessive voltage ringing on the SW node of the IC. The placement of the input capacitor on the board is critical for minimizing the parasitic inductance in the high di/dt loop and accordingly minimizing the SW node ringing at each switching.

For designs targeting the maximum operating voltage of the regulator, make sure that the ringing on the SW node must not exceed the absolute maximum rating of the device. The SW node ringing is a function of how well the input capacitor is positioned with respect to the IC. Refer to the PCB layout example in Layout Example for proper placement of the input capacitors.