SNVSCN7C November   2023  – May 2025 REF54

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics REF54250
    6. 6.6  Electrical Characteristics REF54300
    7. 6.7  Electrical Characteristics REF54410
    8. 6.8  Electrical Characteristics REF54450
    9. 6.9  Electrical Characteristics REF54500
    10. 6.10 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Temperature Drift
    2. 7.2 Long-Term Stability
    3. 7.3 Noise Performance
      1. 7.3.1 1/f Noise
      2. 7.3.2 Broadband Noise
    4. 7.4 Thermal Hysteresis
    5. 7.5 Solder Heat Shift
    6. 7.6 Power Dissipation
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 EN Pin
      2. 8.3.2 NR Pin
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Basic Voltage Reference Connection
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Reference Attach With High Precision ADC
    3. 9.3 Power Supply Recommendation
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) REF54 UNIT
FKH (LCCC) D (SOIC)
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 86.7 120.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 50.4 52 °C/W
RθJB Junction-to-board thermal resistance 49 66 °C/W
ΨJT Junction-to-top characterization parameter 39.8 9.8 °C/W
ΨJB Junction-to-board characterization parameter 15.8 64.7 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.