SPAU023A June   2024  – January 2025

 

  1.   1
  2.   Description
  3.   Features
  4.   4
  5. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
      1. 1.3.1 Functional Block Diagram
      2. 1.3.2 Component Identification
  6. 2Hardware
    1. 2.1 System Description
      1. 2.1.1 Key Features
        1. 2.1.1.1 Power Supply
        2. 2.1.1.2 Memory
        3. 2.1.1.3 JTAG Emulator
        4. 2.1.1.4 Supported Interfaces and Peripherals
        5. 2.1.1.5 Expansion Connectors/Headers to Support Application-specific Add‐On Boards
        6. 2.1.1.6 ADC
      2. 2.1.2 Important Usage Notes:
        1. 2.1.2.1 Electrostatic Discharge (ESD) Compliance
        2. 2.1.2.2 IO Cable Length
      3. 2.1.3 Power ON/OFF Procedures
        1. 2.1.3.1 Power-On Procedure
        2. 2.1.3.2 Power-Off Procedure
        3. 2.1.3.3 Power Test Points
      4. 2.1.4 Peripheral and Major Component Description
        1. 2.1.4.1 Clocking
        2. 2.1.4.2 EtherCAT Interface
          1. 2.1.4.2.1 DP83826 PHY Strapping Configuration
        3. 2.1.4.3 Power
          1. 2.1.4.3.1 Power Requirement
          2. 2.1.4.3.2 Power Input
        4. 2.1.4.4 Emulator Connector (TSW-106-16-G-D) and DAC Connector (TSW-102-16-G-D)
          1. 2.1.4.4.1 TSW-106-16-G-D
          2. 2.1.4.4.2 TSW-102-16-G-D
        5. 2.1.4.5 FSI Header
        6. 2.1.4.6 High Density Connector
          1. 2.1.4.6.1 180-pin HSEC Edge Connector
        7. 2.1.4.7 Use Case for HSEC Adapter Board
          1. 2.1.4.7.1 Case 1: Isolated XDS110 on HSEC Adapter, SOM ,Baseboard
          2. 2.1.4.7.2 Case 2: HSEC Adapter, Isolated XDS110 on SOM, Baseboard
  7. 3Hardware Design Files
  8. 4Additional Information
    1. 4.1 Known Hardware or Software Issues
      1. 4.1.1 EVM Usage Notes
    2. 4.2 Trademarks
  9. 5Revision History

2.1.4.5 FSI Header

Figure 2-9 shows the FSI header connection to the High-density connector.

HSEC180ADAPEVM FSI Header Figure 2-9 FSI Header