SPRAA99C March   2008  – May 2021 AM3351 , AM3352 , AM3354 , AM3356 , AM3357 , AM3358 , AM3359 , AM4372 , AM4376 , AM4377 , AM4378 , AM4379 , OMAPL138B-EP , TMUX646

 

  1.   Trademarks
  2. 1Introduction
  3. 2PCB Design Considerations
    1. 2.1 Solder Land Areas
    2. 2.2 Conductor Width/Spacing
    3. 2.3 High-Density Routing Techniques
    4. 2.4 Via Density
    5. 2.5 Conventional PCB Design
    6. 2.6 Advanced Design Methods
  4. 3Reliability
    1. 3.1 Reliability Calculations
    2. 3.2 Package Characteristics
    3. 3.3 Thermal Modeling
  5. 4Surface-Mounting nFBGA Packages
    1. 4.1 Design for Manufacturability (DFM)
    2. 4.2 Solder Paste
    3. 4.3 Solder Ball Collapse
    4. 4.4 Reflow
    5. 4.5 Inspection
  6. 5Packing and Shipping
    1. 5.1 Tray Packing Method
    2. 5.2 Tape-and-Reel Packing Method
    3. 5.3 Tape Format
    4. 5.4 Device Insertion
    5. 5.5 Packaging Method
  7. 6Sockets
    1. 6.1 The Design Challenge
    2. 6.2 Contacting the Ball
    3. 6.3 Pinch Contact
    4. 6.4 Micro Tuning Fork Contact
    5. 6.5 Texas Instruments Sockets
  8. 7Summary
  9.   A Frequently Asked Questions
    1.     A.1 Package Questions
    2.     A.2 Assembly Questions
    3.     A.3 Small Body nFBGA Package Questions
  10.   B Package Data Sheets
  11.   C Thermal Modeling Results
  12.   Revision History

C Thermal Modeling Results

Table C-1, Table C-2, and Table C-3 detail thermal modeling results from 8x8mm, 12x12mm, and 16x16mm nFBGA packages, respectively.

Table C-1 8×8 mm nFBGA Thermal Simulation Result
Power = 1w Die Size (mm) 2.0 × 2.0 mm 4.0 × 4.0 mm 6.0 × 6.0 mm
Velocity (m/s) 1S0P 2S2P 1S0P 2S2P 1S0P 2S2P
θJA (°C/W) 0 140.148 101.061 100.476 61.161 89.286 50.352
1 129.084 97.211 89.269 57.353 78.173 46.554
2 124.432 96.281 84.656 56.439 73.714 45.622
3 121.435 95.611 81.895 55.675 70.399 44.774
Pusai JT
(°C/W)		 0 2.244 2.076 0.625 0.462 0.509 0.342
1 2.238 2.066 0.582 0.429 0.480 0.308
2 2.215 2.062 0.559 0.403 0.441 0.290
3 2.196 2.059 0.545 0.399 0.429 0.278
Pusai JB
(°C/W)		 0 78.144 80.346 32.656 33.063 20.345 21.658
1 75.007 77.987 30.032 32.785 18.921 21.539
2 74.760 77.876 29.997 32.687 18.710 21.437
3 74.616 77.742 29.733 32.200 18.306 21.380
θJC (°C/W) 29.984 — 12.050 — 7.347 —
θJB (°C/W) 77.056 78.643 31.636 33.043 19.899 21.226
Table C-2 12×12 mm nFBGA Thermal Simulation Result
Power = 1w Die Size (mm) 3.0 × 3.0 mm 6.5 × 6.5mm 10.0 × 10.0 mm
Velocity (m/s) 1S0P 2S2P 1S0P 2S2P 1S0P 2S2P
θJA (°C/W) 0 89.520 62.812 61.940 35.763 53.538 28.380
1 80.639 59.169 52.553 32.150 44.582 24.786
2 77.284 58.444 49.596 31.427 41.273 24.032
3 75.257 57.923 47.675 30.897 39.314 23.518
Pusai JT
(°C/W)		 0 0.855 0.623 0.373 0.274 0.306 0.216
1 0.791 0.589 0.356 0.239 0.246 0.183
2 0.782 0.588 0.321 0.209 0.236 0.176
3 0.732 0.585 0.300 0.207 0.227 0.156
Pusai JB
(°C/W)		 0 46352 49.411 15.822 18.310 8.886 10.687
1 45.699 49.091 15.689 17.954 8.650 10.422
2 45.553 48.646 15.499 17.922 8.472 10.405
3 45.483 48.208 15.424 17.903 8.287 10.380
θJC (°C/W) 16.586 — 5.742 — 4.428 —
θJB (°C/W) 46.695 47.787 15.894 16.429 8.180 8.604
Table C-3 16×16 mm nFBGA Thermal Simulation Result
Power = 1w Die Size (mm) 3.0 × 3.0 mm 8.5 × 8.5mm 14.0 × 14.0 mm
Velocity (m/s) 1S0P 2S2P 1S0P 2S2P 1S0P 2S2P
θJA (°C/W) 0 88.870 69.542 48.861 27.847 39.056 21.145
1 81.509 66.538 69.164 24.125 31.690 17.579
2 79.283 65.851 36.777 23.404 28.913 16.870
3 77.860 65.395 35.387 22.974 27.514 16.410
Pusai JT
(°C/W)		 0 0.888 0.820 0.290 0.355 0.237 0.181
1 0.828 0.755 0.226 0.280 0.177 0.103
2 0.808 0.740 0.225 0.155 0.164 0.099
3 0.801 0.737 0.218 0.153 0.159 0.098
Pusai JB
(°C/W)		 0 59.993 61.429 11.901 12.620 5.252 5.523
1 59.895 61.026 11.667 11.925 5.231 5.470
2 59.349 59.877 11.270 11.591 4.806 5.267
3 59.284 59.842 11.176 11.584 4.776 5.104
θJC (°C/W) 20.002 — 3.797 — 1.853 —
θJB (°C/W) 57.658 58.886 10.183 10.717 4.898 5.158