SPRAAV1C May   2009  – March 2020 AM3703 , AM3715 , OMAP3503 , OMAP3515 , OMAP3525 , OMAP3530

 

  1.   PCB Design Guidelines for 0.4mm Package-On-Package (PoP) Packages, Part I
    1.     Trademarks
    2. Using This Guide
    3. A Word of Caution
    4. A Team Sport
    5. Be Wary of Quotes
    6. Don’t Forget Your CAD Tools
    7. Metric Vs English
    8. PCB Fab Limits
    9. Routing and Layer Stackup
    10. OMAP35x 0.4mm Pitch
    11. 10 Pad Type
    12. 11 PCB Pad Dimensions for 0.4mm BGA Package
    13. 12 Multiple BGA Packages
    14. 13 Etch Traps and Heat Sinks
    15. 14 Vias and VIP
    16. 15 Laser Blind Vias
    17. 16 Filled Vias
    18. 17 Know Your Tools
    19. 18 BeagleBoard
    20. 19 BeagleBoard Views
      1. 19.1 Top Layer – Signal - Area Underneath the OMAP35x
      2. 19.2 Layer 2 – Ground
      3. 19.3 Layer 3 – Signal
      4. 19.4 Layer 4 – Signal
      5. 19.5 Layer 5 – Power (VDD2)
      6. 19.6 Layer 6 – Signal – Bottom Copper – Bottom Component Outlines
    21. 20 OMAP35x Decoupling
    22. 21 PCB Finishes for High Density Interconnect (HDI)
    23. 22 Real World Second Opinion
    24. 23 Acknowledgments
    25. 24 References
  2.   Revision History

A Team Sport

Successful design and assembly of complex, fine-pitch circuit boards is a Team Sport. The days of tossing circuit diagrams over the cubical wall to the board designer who then tosses them to the assembly shop are gone. Today’s board design requires a team approach and the entire process, from component selection to assembly requires careful coordination.

The typical team is composed of four different members representing the four major steps in product fabrication: the device supplier (chips, passives, mechanical), the PCB designer, the PCB fabrication shop, and the PCB assembly shop. There may be more members or some members may do more than one job.

Each of the team members brings their own experiences and design guidelines to bear on the task. As a result, it is not uncommon to find conflicting guidelines. These conflicts must be resolved prior to the start of work. Unresolved conflicts will result in poor assembly yields at best or 100% failure at worst. Constant and frequent communication is the key to resolving conflicts and everyone must be in the loop.

Get to know your team members and be sure to have frequent meetings as the project proceeds from design through production. It will be money and time well spent.

team_eff_praav1.gifFigure 4. PoP Assembly Teamwork