SPRABF9 March   2019 TMS320C6742 , TMS320C6742 , TMS320C6746 , TMS320C6746 , TMS320C6748 , TMS320C6748

 

  1.   1
  2.   Trademarks
  3. 1Introduction
  4. 2Model Activity
    1. 2.1 Activity-Based Models
    2. 2.2 Baseline Power
    3. 2.3 Activity Power
    4. 2.4 Modules
  5. 3Using the Power Estimation Spreadsheet
    1. 3.1 Choosing Appropriate Values
      1. 3.1.1 Utilization
      2. 3.1.2 % Writes
      3. 3.1.3 % Switching
  6. 4Using the Results
    1. 4.1 Adjusting I/O Power Result
  7. 5Thermal Considerations
  8. 6Example
  9. 7Limitations
  10. 8References

5 Thermal Considerations

As integrated circuit (IC) components become more complex, the challenge of producing an end equipment product with good thermal performance also increases. Thermal performance is a system level concern, impacted by IC packaging as well as printed circuit board (PCB) design, PCB characteristics, PCB layout, ambient temperature, and chassis configuration.

In the device-specific data manual, TI specifies not to exceed the maximum operating junction temperature so the device reliability and/or proper operation can be maintained. To meet this requirement, it is important to understand the contribution of the other system characteristics (mentioned above) and design accordingly. Before finalizing system layout and PCB design, verify that the maximum operating junction temperature documented in the device-specific data manual is met.

The spreadsheet that accompanies this application report includes a worksheet that performs the junction temperature calculations described in the Case Temperature Measurement: Accounting for Leakage Variations of Thermal design guide for DSP and Arm application processors. You must enter value from the following fields in the worksheet: package type, core voltage, air flow, case temperature, ambient temperature, total power and static power. All of the remaining fields in the worksheet are calculated based on your inputs.