SPRAD67A december 2022 – july 2023 AM6411 , AM6412 , AM6421 , AM6422 , AM6441 , AM6442
The Thermal Design Guide for DSP and Arm Application Processors application report provides guidance for successful implementation of a thermal solution for board designs containing this processor. This application report provides background information on common terms and methods. TI only supports designs that follow thermal design guidelines contained in the application report.
The required Thermal model can be downloaded from the below sections.