SPRAD67A december   2022  – july 2023 AM6411 , AM6412 , AM6421 , AM6422 , AM6441 , AM6442

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. Introduction
    1. 1.1 Before Getting Started With the Board Design
    2. 1.2 Processor (Device) Selection
      1. 1.2.1 Availability of Tightly Coupled Memory (TCM)
    3. 1.3 Technical Documentation
    4. 1.4 Design Documentation
  5. Block Diagram
    1. 2.1 Creating the Block Diagram
    2. 2.2 Selecting the Boot Mode
    3. 2.3 Confirming Pinmux (Multiplexing Compatibility)
  6. Power Supply
    1. 3.1 Power Supply Architecture
      1. 3.1.1 Integrated Power Architecture
      2. 3.1.2 Discrete Power Architecture
    2. 3.2 Power (Supply) Rails
      1. 3.2.1 Core Supply
      2. 3.2.2 Peripheral Power Supply
      3. 3.2.3 Internal LDO for IO Groups (Processor IO Groups)
      4. 3.2.4 Dual-Voltage IOs (LVCMOS IOs / Processor IOs)
      5. 3.2.5 Dual-Voltage Dynamic Switching IOs for SDIO
      6. 3.2.6 VPP (eFuse ROM Programming Supply)
    3. 3.3 Determining Board Power Requirements
    4. 3.4 Power Supply Filters
    5. 3.5 Power Supply Decoupling and Bulk Capacitors
      1. 3.5.1 Note on PDN Target Impedance
    6. 3.6 Power Supply Sequencing
    7. 3.7 Supply Diagnostics
    8. 3.8 Power Supply Monitoring
  7. Clocking
    1. 4.1 System Clock Input
    2. 4.2 Unused Clock Input
    3. 4.3 Clock Output
    4. 4.4 Single-ended Clock Source
    5. 4.5 Crystal Selection
  8. JTAG (Joint Test Action Group)
    1. 5.1 JTAG / Emulation
      1. 5.1.1 Configuration of JTAG / Emulation
        1. 5.1.1.1 AM64x
        2. 5.1.1.2 AM243x
      2. 5.1.2 Implementation of JTAG / Emulation
      3. 5.1.3 JTAG Termination
  9. Configuration (Processor) and Initialization (Processor and Device)
    1. 6.1 Processor Reset
    2. 6.2 Latching of the Boot Mode Configuration
    3. 6.3 Attach Device Reset
    4. 6.4 Watchdog Timer
  10. Peripherals
    1. 7.1 Selecting Peripherals Across Domains
    2. 7.2 Memory
      1. 7.2.1 Processor DDR Subsystem and Device Register Configuration
    3. 7.3 Media and Data Storage Interfaces
    4. 7.4 Ethernet Interface
      1. 7.4.1 Common Platform Ethernet Switch 3-port Gigabit Ethernet (CPSW3G)
      2. 7.4.2 Programmable Real-Time Unit and Industrial Communication Subsystem - Gigabit (PRU_ICSSG)
    5. 7.5 Universal Serial Bus (USB) Subsystem
    6. 7.6 Peripheral Component Interconnect Express (PCIe) Subsystem
    7. 7.7 General Connectivity Peripherals
    8. 7.8 Analog-to-Digital Converter (ADC)
      1. 7.8.1 Change Summary of AM64x / AM243x SR2.0 ADC Errata
    9. 7.9 Termination of Power Pins, Unused Peripherals and IOs
      1. 7.9.1 External Interrupt (EXTINTn)
  11. Interfacing of IO Buffers and Simulations
    1. 8.1 AM64x
    2. 8.2 AM243x
  12. Power Consumption and Thermal Analysis
    1. 9.1 Power Consumption
    2. 9.2 Maximum Current for Different Supply Rails
    3. 9.3 Power Modes
    4. 9.4 Guidance on Thermal Design
      1. 9.4.1 AM64x
      2. 9.4.2 AM243x
  13. 10Schematic Capture and Review
    1. 10.1 Selection of Components and Components Value
    2. 10.2 Schematic Capture
    3. 10.3 Reviewing the Schematics
  14. 11Floor Planning, Layout and Routing Guidelines
    1. 11.1 Escape Routing Guidelines
    2. 11.2 DDR Layout Guidelines
    3. 11.3 High-Speed Differential Signal Routing Guidance
    4. 11.4 Additional References for Simulation
  15. 12Device Handling and Assembly
  16. 13References
    1. 13.1 AM64x
    2. 13.2 AM243x
    3. 13.3 Common
  17. 14Terminology
  18. 15Revision History

Processor Reset

The processor can be reset in several ways. The methods are described in detail in the device-specific data sheet and TRM.

The processor includes three external reset input pins (MCU_PORz (MCU Domain cold reset), MCU_RESETz (MCU Domain warm reset) and RESET_REQz (Main Domain external warm reset request input)).

Be sure to provide the terminations to the reset inputs as recommended in the Pin Connectivity Requirements section of the device-specific data sheet.

The processor also includes three reset status output pins (MCU_RESETSTATz (MCU Domain warm reset status output), PORz_OUT (Main Domain POR status output) and RESETSTATz (Main Domain warm reset status output)).

Reset status outputs when not used does not need external pull (OK to connect a test point for board testing).

For MCU_PORz (fail-safe), 3.3 V input can be applied, but the input thresholds are still a function of the 1.8 V IO supply voltage (VDDS_OSC).

MCU_PORz reset input signal has input slew rate requirement specified in the device-specific data sheet.

Additional reset modes are available through internal registers and emulation.