SPRT799 September 2025
TMDS62LEVM_Download_Files List document lists names of the folders and file names in the folders along with the format for all the files that have been included in the TMDS62LEVM (for both ORCAD + ALLEGRO based design and ALTIUM based design).
The TMDS62LEVM evaluation module (EVM) is designed for low-cost and performance optimized AM62L family of application processors. TMDS62LEVM evaluation module is built around AM62L processor (11.9mm × 11.9mm, 0.5mm VCA, 373-pin FCCSP BGA package (ANB)), scalable Arm® Cortex®-A53 core performance and embedded features such as: Multimedia DSI support, integrated ADC on chip, advanced lower power management modes, and extensive security options for IP protection and secure boot. The product overview document is available on TMDS62LEVM product folder on TI.com for customer to review before downloading the single Zip folder.
| FOLDER (1st Level) | FOLDER (2nd Level) | Files Inside | File Type |
|---|---|---|---|
| ---- | ---- | PROC181E1-1_Folders_Files_List | XLS |
| 1_SCHEMATIC | 1_ORCAD |
PROC181E1-1_SCH_With_Design _Updates..Notes_V1.0 |
|
|
2_PDF_ Standard |
PROC181E1-1_SCH_With_Design _Updates..Notes_V1.0 |
||
|
3_PDF_ Intelligent |
PROC181E1-1_SCH_With_Design _Updates..Notes_V1.0 |
DSN | |
| 2_BOM | ---- | PROC181E1-1_BOM | XLS |
| 3_Board_File | Allegro | PROC181E1-1_BRD | BRD |
| Simulation Scorecard |
TMDS62LEVM_Simulations _Scorecard |
||
| Altium_ASCII | PROC181E1-1_BRD | ALG | |
| 4_Gerber | ODBGBR | PROC181E1-1_ODBGBR | ZIP |
| 274X | PROC181E1-1_274XGBR | ZIP | |
| IPC-D-356_NETLIST | PROC181E1-1_IPC | IPC | |
| 5_Gerber_PDF | FAB | PROC181E1-1_FAB | |
| PCB LAYERS | PROC181E1-1_ALL_LAYER | ||
| Gerber Layers | PROC181E1-1_ALL_LAYER | ||
|
6_Assembly_Models_Package |
2D | PROC181E1-1_DXF_BASY | DXF |
| PROC181E1-1_DXF_TASY | DXF | ||
| 3D | PROC181E1-1_3D.STEP | STP | |
| IDF | PROC181E1-1_BRD | EMP | |
| PROC181E1-1_BRD | EMN | ||
|
Assembly _Drawing |
PROC181E1-1 ASSEMBLY | ||
| PROC181E1-1_TASY | |||
| PROC181E1-1_BASY | |||
| STNL | art_aper + 8 x .ART files | ART | |
| XY-REP | PROC181E1-1_XY_REP | XLS | |
| 7_PCB_LAYER_STACKUP | --- |
TMDS62LEVM-6L-20-12-2023 -[1639] |
|
|
8_Power_Supply _Sequencing |
--- |
PROC181E1-1_POWER _SEQUENCE |
|
| 9_SysConfig_PinMux _File | --- | TMDS62LEVM | syscfg |
| FOLDER (1st level) | FOLDER (2nd level) | Files Inside | File type |
|---|---|---|---|
| ---- | ---- | PROC181E1-1_Folders_Files_List | XLS |
| 1_SCHEMATIC | 1_Altium |
PROC181E1-1_SCH_With_Design _Updates..Notes_V1.0 |
.SCHDOC |
|
2_PDF_ Standard |
PROC181E1-1_S_SCH_With_Design _Updates..Notes_V1.0 |
||
|
3_PDF_ Intelligent |
PROC181E1-1_I_SCH_With_Design _Updates..Notes_V1.0 |
||
| 2_BOM | ---- | PROC181E1-1_BOM | XLS |
| 3_Board_File | Altium | PROC181E1-1_PRJPCB |
.PCBDOC .PRJPCB |
|
Board_pdf_ dimensions |
PROC181E1-1_BRD | ||
| Simulation Scorecard |
TMDS62LEVM_Simulations _Scorecard |
||
| 4_Gerber | ODBGBR | PROC181E1-1_ODBGBR | TGZ |
| 274X | PROC181E1-1_274XGBR | ZIP | |
|
IPC-D-356 _NETLIST |
PROC181E1-1_IPCD356 | IPC | |
| 5_Gerber_PDF | FAB | PROC181E1-1_FAB | |
| PCB LAYERS | PROC181E1-1_ALL_LAYER | ||
| Gerber Layers | PROC181E1-1_ALL_LAYER | ||
|
6_Assembly_Models_Package |
2D | PROC181E1-1_DXF_BASY | DXF |
| PROC181E1-1_DXF_TASY | DXF | ||
| 3D | PROC181E1-1_3D.STEP | STP | |
| IDF | PROC181E1-1_BRD | EMP | |
| PROC181E1-1_BRD | EMN | ||
| Assembly_Drawing | PROC181E1-1 ASSEMBLY | ||
| PROC181E1-1_TASY | |||
| PROC181E1-1_BASY | |||
| STNL |
PROC181E1-1_BRD_11_3 art _aper + 8 x .ART files |
ART | |
| XY-REP | _PROC181E1-1_XY_REPORT | XLS | |
| 7_PCB_LAYER_STACKUP | --- |
TMDS62LEVM-6L-20-12-2023 -[1639] |
|
|
8_Power_Supply_Sequencing |
--- |
PROC181E1-_POWER_ SEQUENCE_IO_DDR.pdf |
|
|
PROC181E1-1_POWER_ SEQUENCE_RTC_Only.pdf |
|||
| 9_3DBOARD_PDF | PROC181E1-1_3DBOARD | ||
|
10_Gerber_comparision_ALG_PRJPCB_pdf |
PROC181E1-1_gerbet_comparision | ||
| 11_Sysyconfig | TMDS62LEVM | .syscfg |