SPRUJE5A June   2025  – August 2025

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specifications
      1. 1.3.1 External Power Supply or Accessory Requirements
    4. 1.4 Device Information
  7. 2Software
    1. 2.1 Software Description
    2. 2.2 Software Installation
      1. 2.2.1 Install SDK
      2. 2.2.2 Install Additional Software
        1. 2.2.2.1 Install Python
        2. 2.2.2.2 Install OpenSSL
    3. 2.3 Software Development
    4. 2.4 F29H85x LaunchPad Demo Program
    5. 2.5 Programming and Running Other Software on the F29H85x LaunchPad
  8. 3Hardware
    1. 3.1 Hardware Description
      1. 3.1.1 Functional Description and Connections
        1. 3.1.1.1  Microcontroller
        2. 3.1.1.2  PMIC
        3. 3.1.1.3  Power Domains
        4. 3.1.1.4  LEDs
        5. 3.1.1.5  Encoder Connectors
        6. 3.1.1.6  FSI
        7. 3.1.1.7  CAN
        8. 3.1.1.8  SENT
        9. 3.1.1.9  CLB
        10. 3.1.1.10 Boot Modes
        11. 3.1.1.11 BoosterPack Sites
        12. 3.1.1.12 Analog Voltage Reference
        13. 3.1.1.13 Differential ADC Header
        14. 3.1.1.14 Other Headers and Jumpers
          1. 3.1.1.14.1 XDS Isolation Block
          2. 3.1.1.14.2 BoosterPack Site 2 Power Isolation
          3. 3.1.1.14.3 Alternate Power
      2. 3.1.2 Debug Interface
        1. 3.1.2.1 XDS110 Debug Probe
        2. 3.1.2.2 XDS110 Output
        3. 3.1.2.3 Virtual COM Port
      3. 3.1.3 Alternate Routing
        1. 3.1.3.1 Overview
        2. 3.1.3.2 UART Routing
        3. 3.1.3.3 EQEP Routing
        4. 3.1.3.4 CAN Routing
        5. 3.1.3.5 FSI Routing
        6. 3.1.3.6 PWM DAC
      4. 3.1.4 Hardware Revisions
        1. 3.1.4.1 Revision A
  9. 4Hardware Design Files
    1. 4.1 Schematics
    2. 4.2 PCB Layouts
      1. 4.2.1 LAUNCHXL-F29H85X Board Dimensions
    3. 4.3 Bill of Materials (BOM)
  10. 5Frequently Asked Questions
  11. 6Additional Information
    1. 6.1 Trademarks
  12. 7References
    1. 7.1 Reference Documents
    2. 7.2 Other TI Components Used in This Design
  13. 8Revision History
3.1.1.14.1 XDS Isolation Block

JP1 is provided to enable isolation between the device and the connected XDS in higher-voltage applications. The area of isolation is defined by the white outline on the upper-side of the LaunchPad. JP1 has two removable shunts to separate the GND and 5V power of the USB/XDS region and the F29H85x MCU region of the LaunchPad. By default, both shunts are populated and the power is supplied by the connected USB, meaning that the USB and XDS110 are NOT isolated from the F29H85x MCU region. If power isolation is desired, remove the supplied shunts from JP1. In this configuration, one of the two external power options below are required:

  • An external 5-V supply to power the PMIC (TPS65036), which provides 3.3V to the F29H85x MCU region of the board.
  • An external 3.3-V supply to power the F29H85x MCU region of the board.

    5V is generated using the on-board 5V BOOST (TPS610333).

In an isolated power application with JP1 shunts removed, make sure the proper shunts on the F29H85x MCU region of the board are populated. For more information, see Section 3.1.1.3.