SPRUJF0 August   2025 F28E120SB , F28E120SC , TMS320F2802-Q1 , TMS320F28020 , TMS320F280200 , TMS320F28021 , TMS320F28022 , TMS320F28022-Q1 , TMS320F280220 , TMS320F28023 , TMS320F28023-Q1 , TMS320F280230 , TMS320F28026 , TMS320F28026-Q1 , TMS320F28026F , TMS320F28027 , TMS320F28027-Q1 , TMS320F280270 , TMS320F28027F , TMS320F28027F-Q1 , TMS320F28030 , TMS320F28030-Q1 , TMS320F28031 , TMS320F28031-Q1 , TMS320F28032 , TMS320F28032-Q1 , TMS320F28033 , TMS320F28033-Q1 , TMS320F28034 , TMS320F28034-Q1 , TMS320F28035 , TMS320F28035-EP , TMS320F28035-Q1

 

  1.   1
  2.   TMS320F2802x/TMS320F2803x to TMS320F28E12x Migration Overview
  3.   Trademarks
  4. 1 Introduction
    1. 1.1 Abbreviations
  5. 2 Central Processing Unit (CPU)
  6. 3 Development Tools
    1. 3.1 Driver Library (Driverlib)
    2. 3.2 Migrating Between IQ_Math and Native Floating-Point
    3. 3.3 Embedded Application Binary Interface (EABI) Support
  7. 4 Package and Pinout
  8. 5 Operating Frequency and Power Management
  9. 6 Power Sequencing
  10. 7 Memory Map
    1. 7.1 Random Access Memory (RAM)
    2. 7.2 Flash and OTP
      1. 7.2.1 Size and Number of Sectors
      2. 7.2.2 Flash Parameters
      3. 7.2.3 Entry Point into Flash
      4. 7.2.4 Dual Code Security Module (DCSM) and Password Locations
      5. 7.2.5 OTP
      6. 7.2.6 Flash Programming
    3. 7.3 Boot ROM
      1. 7.3.1 Boot ROM Reserved RAM
      2. 7.3.2 Boot Mode Selection
      3. 7.3.3 Bootloaders
  11. 8 Architectural Enhancements
    1. 8.1 Clock Sources and Domains
    2. 8.2 Dual-Clock Comparator (DCC) Module
    3. 8.3 Watchdog Timer
    4. 8.4 Peripheral Interrupt Expansion (PIE)
    5. 8.5 Lock Protection Registers
    6. 8.6 General-Purpose Input/Output (GPIO)
    7. 8.7 External Interrupts
    8. 8.8 Crossbar (X-BAR)
  12. 9 Peripherals
    1. 9.1 New Peripherals
      1. 9.1.1 Direct Memory Access (DMA)
      2. 9.1.2 Analog Subsystem Interconnect
      3. 9.1.3 Comparator Subsystem (CMPSS)
      4. 9.1.4 Programmable Gain Amplifier (PGA)
    2. 9.2 Control Peripherals
      1. 9.2.1 Enhanced Pulse Width Modulator (MCPWM)
      2. 9.2.2 Enhanced Capture Module (eCAP)
      3. 9.2.3 Enhanced Quadrature Encode Pulse Module (eQEP)
    3. 9.3 Analog Peripherals
      1. 9.3.1 Analog-to-Digital Converter (ADC)
    4. 9.4 Communication Peripherals
      1. 9.4.1 SPI
      2. 9.4.2 SCI
      3. 9.4.3 UART
      4. 9.4.4 I2C
  13. 10Emulation – JTAG Port
  14. 11Silicon Errata
  15. 12Device Comparison Summary
  16. 13References

1 Introduction

The TMS320F2802x/TMS320F2803x and F28E12x are device members of the C2000™ MCU product family. These devices are most commonly used within embedded control applications. The F28E12x devices feature an updated version of the enhanced control peripherals found on the TMS320F2802x/TMS320F2803x, which allows for greater flexibility and improved application performance. In addition, the F28E12x devices feature a boot mode flow that enables expanded booting options that provide the ability to use alternate, reduce, or completely eliminate boot mode selection pins, and an analog subsystem interconnect that enables a very flexible pin usage, allowing for smaller device packages. Central to the analog subsystem interconnect are multiple analog comparator subsystems (CMPSS). Enhancements include the addition of a floating-point unit (FPU) to the CPU, a direct memory access (DMA) controller and three cross-bars (XBARs) for providing a flexible means for interconnecting multiple inputs, outputs, and internal resources.

For the purposes of migration, TMS320F2802x and TMS320F2803x – these devices are referenced as the F2802x and F2803x, respectively. When referenced as both the F2802x and F2803x, this combined group of devices can be referenced as F2802x/03x. If a feature is unique to a specific device type, it is referenced as F2802x or F2803x.

For a full list of devices currently available within the F2802x, F2803x, and F28E12x families, see the TI website at http://www.ti.com/c2000.

As the focus of this document is to describe the differences between the two device groups, the descriptions are explained only to the extent of highlighting areas that require attention when moving an application from one device to the other. For a detailed description of features specific to each device, see the device-specific technical reference manuals and user's guides available on the TI website at http://www.ti.com/c2000. This application report does not cover the silicon exceptions or advisories that can be present on each device.

Consult the following silicon errata for specific advisories and workarounds:

Note: For information regarding any electrical specifications, always refer to the TMS data sheet.