SPRY345C February   2022  – October 2024 DP83TG720R-Q1 , DP83TG720S-Q1 , TCAN1043A-Q1

 

  1.   1
  2.   At a glance
  3.   Introduction
  4.   Overcoming E/E architecture challenges
  5.   Power distribution challenges and solutions
  6.   Decentralization of power distribution
  7.   Replacing melting fuses with semiconductor fuses
  8.   Smart sensor and actuator challenges and solutions
  9.   Zonal modules –new microcontroller requirements
  10.   Smart sensors and actuators
  11.   Data challenges and solutions
  12.   Types of data
  13.   Time sensitivity of data
  14.   Communication security
  15.   Conclusion

Introduction

Electronics have played a key role in automotive system innovations in the past several decades. The incorporation of new semiconductor devices with novel features has enhanced the functionality offered by the vehicle’s mechanical systems.

While semiconductor solutions and electronics continue to play a key role in vehicle electronics, looking ahead, innovation in vehicles will be much more characterized by innovations in and consolidation of software. This change in software architectures is enabled through the development of relevant hardware and semiconductor solutions.