SPRZ436G October   2015  – February 2021 AM5706 , AM5708 , AM5716 , AM5718 , AM5718-HIREL

 

  1. 1Introduction
    1.     Related Documentation
    2.     Trademarks
    3.     Modules Impacted
  2. 2Silicon Advisories
    1.     Revisions SR 2.1, 2.0, 1.0 - Advisories List
    2.     i202
    3.     i378
    4.     i631
    5.     i694
    6.     i698
    7.     i699
    8.     i709
    9.     i727
    10.     i729
    11.     i734
    12.     i767
    13.     i782
    14.     i783
    15.     i802
    16.     i803
    17.     i807
    18.     i808
    19.     i809
    20.     i810
    21.     i813
    22.     i814
    23.     i815
    24.     i818
    25.     i819
    26.     i820
    27.     i824
    28.     i826
    29.     i829
    30.     i834
    31.     i849
    32.     i856
    33.     i862
    34.     i863
    35.     i867
    36.     i868
    37.     i869
    38.     i870
    39.     i871
    40.     i872
    41.     i874
    42.     i875
    43.     i878
    44.     i879
    45.     i880
    46.     i882
    47.     i883
    48.     i887
    49.     i889
    50.     i890
    51.     i893
    52.     i895
    53.     i896
    54.     i897
    55.     i898
    56.     i899
    57.     i900
    58.     i903
    59.     i904
    60.     i906
    61.     i907
    62.     i913
    63.     i916
    64.     i927
    65.     i928
    66.     i929
    67.     i930
    68.     i932
    69.     i933
    70.     i936
    71.     i940
  3. 3Silicon Limitations
    1.     Revisions SR 2.1, 2.0, 1.0 - Limitations List
    2.     i596
    3.     i641
    4.     i833
    5.     i838
    6.     i845
    7.     i848
    8.     i876
    9.     i877
    10.     i892
    11.     i909
    12.     i922
    13.     i925
  4. 4Silicon Cautions
    1.     Revisions SR 2.1, 2.0, 1.0 - Cautions List
    2.     i827
    3.     i832
    4.     i836
    5.     i839
    6.     i864
    7.     i885
    8.     i886
    9.     i912
    10.     i918
    11.     i920
    12.     i921
    13.     i926
    14.     i931
    15.     i934
    16.     i935
  5. 5Revision History

i729

DDR Access Hang after Warm Reset

CRITICALITY

Medium

DESCRIPTION

When warm reset is asserted, EMIF will preserve the contents of the DDR by entering self-refresh. During warm reset the DDR clock source is set to a slower PLL bypass than during normal operation. This causes the following JEDEC spec violations and could result in a DDR access hang after warm reset:

  • DDR clock frequency to the DDR memory is lower than the JEDEC min. clock frequency specified as tCK(avg) min parameter in the JEDEC JESD79-3F DDR3 standard
  • Upon warm reset de-assertion, DDR is taken out of self-refresh and DDR clock frequency is changed from PLL bypass to normal operating frequency. This violates the JEDEC JESD79-3F DDR3 standard that requires input clock to be stable during normal operation

WORKAROUND

There are 2 possible work-arounds:

  1. Use workaround as outlined in Errata i862 to convert warm reset to PORz. Warm reset will function the same as cold reset with this approach .
  2. Use external circuitry to apply reset on DDR RESET# pin when warm reset is asserted. DDR contents will be erased upon warm reset with this approach.

REVISIONS IMPACTED

AM571x SR 2.1, 2.0, 1.0
AM570x SR 2.1, 2.0

DRA79x: 2.1, 2.0

TDA2Ex (23mm): 2.0, 1.0

TDA2Ex (17mm): 2.1, 2.0

AM571x: 2.1, 2.0, 1.0

AM570x: 2.1, 2.0

DRA72x: 2.0, 1.0

DRA71x: 2.1, 2.0