SWAS034A February   2017  – May 2021 CC3120

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Functional Block Diagrams
  5. 5 Revision History
  6. 6 Device Comparison
    1. 6.1 Related Products
  7. 7 Terminal Configuration and Functions
    1. 7.1 Pin Diagram
    2. 7.2 Pin Attributes
    3. 7.3 Connections for Unused Pins
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Power-On Hours (POH)
    4. 8.4  Recommended Operating Conditions
    5. 8.5  Current Consumption Summary
    6. 8.6  TX Power and IBAT versus TX Power Level Settings
    7. 8.7  Brownout and Blackout Conditions
    8. 8.8  Electrical Characteristics (3.3 V, 25°C)
    9. 8.9  WLAN Receiver Characteristics
    10. 8.10 WLAN Transmitter Characteristics
    11. 8.11 WLAN Filter Requirements
      1. 8.11.1 WLAN Filter Requirements
    12. 8.12 Thermal Resistance Characteristics
      1. 8.12.1 Thermal Resistance Characteristics for RGK Package
    13. 8.13 Reset Requirement
    14. 8.14 Timing and Switching Characteristics
      1. 8.14.1 Power Supply Sequencing
      2. 8.14.2 Device Reset
      3. 8.14.3 Reset Timing
        1. 8.14.3.1 nRESET (32-kHz Crystal)
        2. 8.14.3.2 First-Time Power-Up and Reset Removal Timing Requirements (32-kHz Crystal)
        3. 8.14.3.3 nRESET (External 32-kHz)
          1. 8.14.3.3.1 First-Time Power-Up and Reset Removal Timing Requirements (External 32-kHz)
      4. 8.14.4 Wakeup From HIBERNATE Mode
        1. 8.14.4.1 nHIB Timing Requirements
      5. 8.14.5 Clock Specifications
        1. 8.14.5.1 Slow Clock Using Internal Oscillator
          1. 8.14.5.1.1 RTC Crystal Requirements
        2. 8.14.5.2 Slow Clock Using an External Clock
          1. 8.14.5.2.1 External RTC Digital Clock Requirements
        3. 8.14.5.3 Fast Clock (Fref) Using an External Crystal
          1. 8.14.5.3.1 WLAN Fast-Clock Crystal Requirements
        4. 8.14.5.4 Fast Clock (Fref) Using an External Oscillator
          1. 8.14.5.4.1 External Fref Clock Requirements (–40°C to +85°C)
      6. 8.14.6 Interfaces
        1. 8.14.6.1 Host SPI Interface Timing
          1. 8.14.6.1.1 Host SPI Interface Timing Parameters
        2. 8.14.6.2 Flash SPI Interface Timing
          1. 8.14.6.2.1 Flash SPI Interface Timing Parameters
    15. 8.15 External Interfaces
      1. 8.15.1 SPI Flash Interface
        1. 8.15.1.1 SPI Flash Interface
      2. 8.15.2 SPI Host Interface
        1. 8.15.2.1 SPI Host Interface
      3. 8.15.3 Host UART Interface
        1. 8.15.3.1 SimpleLink™ UART Configuration
        2. 8.15.3.2 5-Wire UART Topology
        3. 8.15.3.3 4-Wire UART Topology
        4. 8.15.3.4 3-Wire UART Topology
  9. 9 Detailed Description
    1. 9.1 Device Features
      1. 9.1.1 WLAN
      2. 9.1.2 Network Stack
      3. 9.1.3 Security
      4. 9.1.4 Host Interface and Driver
      5. 9.1.5 System
    2. 9.2 Power-Management Subsystem
      1. 9.2.1 VBAT Wide-Voltage Connection
      2. 9.2.2 Preregulated 1.85V
    3. 9.3 Low-Power Operating Modes
      1. 9.3.1 Low-Power Deep Sleep
      2. 9.3.2 Hibernate
      3. 9.3.3 Shutdown
    4. 9.4 Memory
      1. 9.4.1 External Memory Requirements
    5. 9.5 Restoring Factory Default Configuration
  10. 10Applications, Implementation, and Layout
    1. 10.1 Application Information
      1. 10.1.1 Typical Application—CC3120R Wide-Voltage Mode
      2. 10.1.2 Typical Application Schematic—CC3120R Preregulated, 1.85-V Mode
    2. 10.2 PCB Layout Guidelines
      1. 10.2.1 General PCB Guidelines
      2. 10.2.2 Power Layout and Routing
        1. 10.2.2.1 Design Considerations
      3. 10.2.3 Clock Interfaces
      4. 10.2.4 Digital Input and Output
      5. 10.2.5 RF Interface
  11. 11Device and Documentation Support
    1. 11.1 Development Tools and Software
    2. 11.2 Firmware Updates
    3. 11.3 Device Nomenclature
    4. 11.4 Documentation Support
    5. 11.5 Support Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Export Control Notice
    9. 11.9 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information

8.14.5.1 Slow Clock Using Internal Oscillator

The RTC crystal connected on the device supplies the free-running slow clock. The accuracy of the slow clock frequency must be 32.768 kHz ±150 ppm. In this mode of operation, the crystal is tied between RTC_XTAL_P (pin 51) and RTC_XTAL_N (pin 52) with a suitable load capacitance to meet the ppm requirement.

Figure 8-9 shows the crystal connections for the slow clock.

GUID-71884258-9BEC-48E6-8570-2782BF290408-low.gifFigure 8-9 RTC Crystal Connections

 

Section 8.14.5.1.1 lists the RTC crystal requirements.