SWRA640G December   2018  – September 2022 CC1310 , CC1312R , CC1314R10 , CC1350 , CC1352P , CC1352R , CC1354P10 , CC1354R10 , CC2620 , CC2630 , CC2640 , CC2640R2F , CC2640R2F-Q1 , CC2642R , CC2642R-Q1 , CC2650 , CC2652P , CC2652R , CC2652R7 , CC2652RB , CC2652RSIP , CC2662R-Q1 , CC2674P10 , CC2674R10

 

  1.   Trademarks
  2.   CC13xx/CC26xx Hardware Configuration and PCB Design Considerations
  3. 1 Reference Design
    1. 1.1 Sub-1 GHz LaunchPads
      1. 1.1.1 LAUNCHXL-CC1310
      2. 1.1.2 LAUNCHXL-CC1312R
    2. 1.2 2.4 GHz LaunchPads
      1. 1.2.1 LAUNCHXL-CC2640R2
      2. 1.2.2 LAUNCHXL-CC26x2R
    3. 1.3 Dual-Band LaunchPads
      1. 1.3.1 LAUNCHXL-CC1350EU/US
      2. 1.3.2 LAUNCHXL-CC1350-4
      3. 1.3.3 LAUNCHXL-CC1352R
      4. 1.3.4 LAUNCHXL-CC1352P1
      5. 1.3.5 LAUNCHXL-CC1352P-2
      6. 1.3.6 LAUNCHXL-CC1352P-4
    4. 1.4 Reference Design Overview
  4. 2 Front-End Configurations
    1. 2.1 CC13xx/CC26xx
    2. 2.2 Configuring Front-End Mode
    3. 2.3 CC13xx Single-Ended Mode
      1. 2.3.1 Single-Ended RX/TX
      2. 2.3.2 Single-Ended TX Only
      3. 2.3.3 Single-Ended RX Only
      4. 2.3.4 Single-Ended 2.4 GHz
    4. 2.4 CC26xx
  5. 3 Schematic
    1. 3.1 Schematic Overview
      1. 3.1.1 24/48 MHz Crystal
      2. 3.1.2 32.768 kHz Crystal
      3. 3.1.3 Balun
      4. 3.1.4 Filter
      5. 3.1.5 RX_TX Pin
      6. 3.1.6 Decoupling Capacitors
      7. 3.1.7 Antenna Components
      8. 3.1.8 RF Shield
      9. 3.1.9 I/O Pins Drive Strength
    2. 3.2 Bootloader Pins
    3. 3.3 AUX Pins
      1. 3.3.1 CC26x2/CC13x2 AUX Pins
      2. 3.3.2 CC26x0/CC13x0 AUX Pins
    4. 3.4 JTAG Pins
  6. 4 PCB Layout
    1. 4.1  Board Stack-Up
    2. 4.2  Balun
    3. 4.3  LC Filter
    4. 4.4  Decoupling Capacitors
    5. 4.5  Placement of Crystal Load Capacitors
    6. 4.6  Current Return Path
    7. 4.7  DC/DC Regulator
    8. 4.8  Antenna Matching Components
    9. 4.9  Transmission Lines
    10. 4.10 Electromagnetic Simulation
  7. 5 Antenna
    1. 5.1 Single-Band Antenna
    2. 5.2 Dual-Band Antenna
      1. 5.2.1 Dual-Band Antenna Match Example: 863-928 MHz and 2.4 GHz
      2. 5.2.2 Dual-Band Antenna Match: 433-510 MHz and 2.4 GHz
  8. 6 Crystal Tuning
    1. 6.1 CC13xx/CC26xx Crystal Oscillators
    2. 6.2 Crystal Selection
    3. 6.3 Tuning the LF Crystal Oscillator
    4. 6.4 Tuning the HF Oscillator
  9. 7 TCXO Support
    1. 7.1 Hardware
    2. 7.2 Software
    3. 7.3 Example: Usage of TCXO on CC1312R Launchpad
  10. 8 Integrated Passive Component (IPC)
  11. 9 Optimum Load Impedance
  12. 10PA Table
  13. 11Power Supply Configuration
    1. 11.1 Introduction
    2. 11.2 DC/DC Converter Mode
    3. 11.3 Global LDO Mode
    4. 11.4 External Regulator Mode
  14. 12Board Bring-Up
    1. 12.1 Power On
    2. 12.2 RF Test: SmartRF Studio
    3. 12.3 RF Test: Conducted Measurements
      1. 12.3.1 Sensitivity
      2. 12.3.2 Output Power
    4. 12.4 Software Bring-Up
    5. 12.5 Hardware Troubleshooting
      1. 12.5.1 No Link: RF Settings
      2. 12.5.2 No Link: Frequency Offset
      3. 12.5.3 Poor Link: Antenna
      4. 12.5.4 Bluetooth Low Energy: Device Does Advertising But Can Not Connect
      5. 12.5.5 Poor Sensitivity: DCDC Layout
      6. 12.5.6 Poor Sensitivity: Background noise
      7. 12.5.7 High Sleep Power Consumption
  15. 13References
  16. 14Revision History

12.2 RF Test: SmartRF Studio

In order to use SmartRF Studio for testing, the board needs a connector that enables a debugger to be connected directly to the RF chip:

  • For the CC13xx and CC26xx, an XDS100v3, XDS110 or XDS200 should be used.

The required pins in cJTAG-mode are VDDS, GND, RESET, TCK and TMS.

  1. Connect a debugger to the board. Open SmartRF Studio and verify that the device is visible in the list of connected devices.
  2. Place two good known boards with 2 m distance. In this context “good known boards“ are EM’s or LaunchPads from TI. Use a predefined PHY setting in SmartRF Studio that is a closest match to the PHY that will be used in the final product
  3. Set one board to PacketRX and the other to PacketTX and transmit 100 packets. Confirm that the packets are received and note the RSSI for the received packets.
  4. Replace the board used in TX with the device under test (DUT). Repeat the test described in 3.
  5. Replace the board used in RX with the DUT. Replace the board used in TX with a good known board. Repeat the test described in 3.
  6. If possible, the measurements should be done with a good known antenna first and then repeated with the antenna that is going to be used in the final design later. A poorly tuned antenna could cause a significant loss in sensitivity/output power.
  7. If the results are satisfactory, change the settings from the predefined setting to the RF settings planned to be used in the final product. Repeat the tests described in 3 to 5 with the wanted RF settings.

If the RSSI deviates from the reference, the schematic and layout should be reviewed. Note that if the network between the RF ports and the antenna on the customer board is different from the TI evaluation board, the losses due to SAW filters and switches must be to be taken into consideration.