SWRA640G December   2018  – September 2022 CC1310 , CC1312R , CC1314R10 , CC1350 , CC1352P , CC1352R , CC1354P10 , CC1354R10 , CC2620 , CC2630 , CC2640 , CC2640R2F , CC2640R2F-Q1 , CC2642R , CC2642R-Q1 , CC2650 , CC2652P , CC2652R , CC2652R7 , CC2652RB , CC2652RSIP , CC2662R-Q1 , CC2674P10 , CC2674R10

 

  1.   Trademarks
  2.   CC13xx/CC26xx Hardware Configuration and PCB Design Considerations
  3. 1 Reference Design
    1. 1.1 Sub-1 GHz LaunchPads
      1. 1.1.1 LAUNCHXL-CC1310
      2. 1.1.2 LAUNCHXL-CC1312R
    2. 1.2 2.4 GHz LaunchPads
      1. 1.2.1 LAUNCHXL-CC2640R2
      2. 1.2.2 LAUNCHXL-CC26x2R
    3. 1.3 Dual-Band LaunchPads
      1. 1.3.1 LAUNCHXL-CC1350EU/US
      2. 1.3.2 LAUNCHXL-CC1350-4
      3. 1.3.3 LAUNCHXL-CC1352R
      4. 1.3.4 LAUNCHXL-CC1352P1
      5. 1.3.5 LAUNCHXL-CC1352P-2
      6. 1.3.6 LAUNCHXL-CC1352P-4
    4. 1.4 Reference Design Overview
  4. 2 Front-End Configurations
    1. 2.1 CC13xx/CC26xx
    2. 2.2 Configuring Front-End Mode
    3. 2.3 CC13xx Single-Ended Mode
      1. 2.3.1 Single-Ended RX/TX
      2. 2.3.2 Single-Ended TX Only
      3. 2.3.3 Single-Ended RX Only
      4. 2.3.4 Single-Ended 2.4 GHz
    4. 2.4 CC26xx
  5. 3 Schematic
    1. 3.1 Schematic Overview
      1. 3.1.1 24/48 MHz Crystal
      2. 3.1.2 32.768 kHz Crystal
      3. 3.1.3 Balun
      4. 3.1.4 Filter
      5. 3.1.5 RX_TX Pin
      6. 3.1.6 Decoupling Capacitors
      7. 3.1.7 Antenna Components
      8. 3.1.8 RF Shield
      9. 3.1.9 I/O Pins Drive Strength
    2. 3.2 Bootloader Pins
    3. 3.3 AUX Pins
      1. 3.3.1 CC26x2/CC13x2 AUX Pins
      2. 3.3.2 CC26x0/CC13x0 AUX Pins
    4. 3.4 JTAG Pins
  6. 4 PCB Layout
    1. 4.1  Board Stack-Up
    2. 4.2  Balun
    3. 4.3  LC Filter
    4. 4.4  Decoupling Capacitors
    5. 4.5  Placement of Crystal Load Capacitors
    6. 4.6  Current Return Path
    7. 4.7  DC/DC Regulator
    8. 4.8  Antenna Matching Components
    9. 4.9  Transmission Lines
    10. 4.10 Electromagnetic Simulation
  7. 5 Antenna
    1. 5.1 Single-Band Antenna
    2. 5.2 Dual-Band Antenna
      1. 5.2.1 Dual-Band Antenna Match Example: 863-928 MHz and 2.4 GHz
      2. 5.2.2 Dual-Band Antenna Match: 433-510 MHz and 2.4 GHz
  8. 6 Crystal Tuning
    1. 6.1 CC13xx/CC26xx Crystal Oscillators
    2. 6.2 Crystal Selection
    3. 6.3 Tuning the LF Crystal Oscillator
    4. 6.4 Tuning the HF Oscillator
  9. 7 TCXO Support
    1. 7.1 Hardware
    2. 7.2 Software
    3. 7.3 Example: Usage of TCXO on CC1312R Launchpad
  10. 8 Integrated Passive Component (IPC)
  11. 9 Optimum Load Impedance
  12. 10PA Table
  13. 11Power Supply Configuration
    1. 11.1 Introduction
    2. 11.2 DC/DC Converter Mode
    3. 11.3 Global LDO Mode
    4. 11.4 External Regulator Mode
  14. 12Board Bring-Up
    1. 12.1 Power On
    2. 12.2 RF Test: SmartRF Studio
    3. 12.3 RF Test: Conducted Measurements
      1. 12.3.1 Sensitivity
      2. 12.3.2 Output Power
    4. 12.4 Software Bring-Up
    5. 12.5 Hardware Troubleshooting
      1. 12.5.1 No Link: RF Settings
      2. 12.5.2 No Link: Frequency Offset
      3. 12.5.3 Poor Link: Antenna
      4. 12.5.4 Bluetooth Low Energy: Device Does Advertising But Can Not Connect
      5. 12.5.5 Poor Sensitivity: DCDC Layout
      6. 12.5.6 Poor Sensitivity: Background noise
      7. 12.5.7 High Sleep Power Consumption
  15. 13References
  16. 14Revision History

12.3.1 Sensitivity

  1. Disconnect the antenna and perform conducted measurements at the SMA connector or solder a semi rigid coax cable at the 50 Ω point.
  2. Configure the board under test and use the PacketRX option in SmartRF Studio similar to the test described in Section 12.2. In PacketRX mode, you can set an expected packet count.
  3. Preferred: Use a signal generator that is capable of transmitting data packets. Remember to set up the sync word and CRC correctly.
  4. If a signal generator is not available, use an EM/LaunchPad as a transmitter. Use coax cables and attenuation between the EM/LauncPad SMA connector and the 50 Ω point on the custom board.
    Note: It is difficult to get an accurate number using this method since the exact values of output power and attenuation are normally not known. Some energy will also travel over the air from the EM to the DUT. In addition, background noise could impact the results. To get more accurate results, the receiver should be placed in a shielded box.
  5. SmartRF Studio will calculate the packet error rate (PER) and bit error rate (BER).

If the wanted RF settings are different from the predefined setting, PER vs level should be run in addition. The input power level should be increased in 1- 2 dB steps from the sensitivity limit to around 0 dBm. For each power level, transmit at least 100 packets and record the PER. If the AGC settings are not optimal it is common that the PER for some of the steps will be above 0 (residual PER) and if that is the case the AGC settings have to be reviewed.

If the conducted sensitivity is poor:

  • Are the settings the same as the recommended values from SmartRF Studio? If the sensitivity is good when using SmartRF Studio and not with the settings used for the project the settings have to be reviewed.
  • What is the frequency difference between the DUT and the signal source? Frequency offset can be measured by transmitting an un-modulated continuous wave
  • Is the schematic, including all component values, in accordance with the reference design?
  • Is the layout in accordance with the reference design?