SWRA640G December   2018  – September 2022 CC1310 , CC1312R , CC1314R10 , CC1350 , CC1352P , CC1352R , CC1354P10 , CC1354R10 , CC2620 , CC2630 , CC2640 , CC2640R2F , CC2640R2F-Q1 , CC2642R , CC2642R-Q1 , CC2650 , CC2652P , CC2652R , CC2652R7 , CC2652RB , CC2652RSIP , CC2662R-Q1 , CC2674P10 , CC2674R10

 

  1.   Trademarks
  2.   CC13xx/CC26xx Hardware Configuration and PCB Design Considerations
  3. 1 Reference Design
    1. 1.1 Sub-1 GHz LaunchPads
      1. 1.1.1 LAUNCHXL-CC1310
      2. 1.1.2 LAUNCHXL-CC1312R
    2. 1.2 2.4 GHz LaunchPads
      1. 1.2.1 LAUNCHXL-CC2640R2
      2. 1.2.2 LAUNCHXL-CC26x2R
    3. 1.3 Dual-Band LaunchPads
      1. 1.3.1 LAUNCHXL-CC1350EU/US
      2. 1.3.2 LAUNCHXL-CC1350-4
      3. 1.3.3 LAUNCHXL-CC1352R
      4. 1.3.4 LAUNCHXL-CC1352P1
      5. 1.3.5 LAUNCHXL-CC1352P-2
      6. 1.3.6 LAUNCHXL-CC1352P-4
    4. 1.4 Reference Design Overview
  4. 2 Front-End Configurations
    1. 2.1 CC13xx/CC26xx
    2. 2.2 Configuring Front-End Mode
    3. 2.3 CC13xx Single-Ended Mode
      1. 2.3.1 Single-Ended RX/TX
      2. 2.3.2 Single-Ended TX Only
      3. 2.3.3 Single-Ended RX Only
      4. 2.3.4 Single-Ended 2.4 GHz
    4. 2.4 CC26xx
  5. 3 Schematic
    1. 3.1 Schematic Overview
      1. 3.1.1 24/48 MHz Crystal
      2. 3.1.2 32.768 kHz Crystal
      3. 3.1.3 Balun
      4. 3.1.4 Filter
      5. 3.1.5 RX_TX Pin
      6. 3.1.6 Decoupling Capacitors
      7. 3.1.7 Antenna Components
      8. 3.1.8 RF Shield
      9. 3.1.9 I/O Pins Drive Strength
    2. 3.2 Bootloader Pins
    3. 3.3 AUX Pins
      1. 3.3.1 CC26x2/CC13x2 AUX Pins
      2. 3.3.2 CC26x0/CC13x0 AUX Pins
    4. 3.4 JTAG Pins
  6. 4 PCB Layout
    1. 4.1  Board Stack-Up
    2. 4.2  Balun
    3. 4.3  LC Filter
    4. 4.4  Decoupling Capacitors
    5. 4.5  Placement of Crystal Load Capacitors
    6. 4.6  Current Return Path
    7. 4.7  DC/DC Regulator
    8. 4.8  Antenna Matching Components
    9. 4.9  Transmission Lines
    10. 4.10 Electromagnetic Simulation
  7. 5 Antenna
    1. 5.1 Single-Band Antenna
    2. 5.2 Dual-Band Antenna
      1. 5.2.1 Dual-Band Antenna Match Example: 863-928 MHz and 2.4 GHz
      2. 5.2.2 Dual-Band Antenna Match: 433-510 MHz and 2.4 GHz
  8. 6 Crystal Tuning
    1. 6.1 CC13xx/CC26xx Crystal Oscillators
    2. 6.2 Crystal Selection
    3. 6.3 Tuning the LF Crystal Oscillator
    4. 6.4 Tuning the HF Oscillator
  9. 7 TCXO Support
    1. 7.1 Hardware
    2. 7.2 Software
    3. 7.3 Example: Usage of TCXO on CC1312R Launchpad
  10. 8 Integrated Passive Component (IPC)
  11. 9 Optimum Load Impedance
  12. 10PA Table
  13. 11Power Supply Configuration
    1. 11.1 Introduction
    2. 11.2 DC/DC Converter Mode
    3. 11.3 Global LDO Mode
    4. 11.4 External Regulator Mode
  14. 12Board Bring-Up
    1. 12.1 Power On
    2. 12.2 RF Test: SmartRF Studio
    3. 12.3 RF Test: Conducted Measurements
      1. 12.3.1 Sensitivity
      2. 12.3.2 Output Power
    4. 12.4 Software Bring-Up
    5. 12.5 Hardware Troubleshooting
      1. 12.5.1 No Link: RF Settings
      2. 12.5.2 No Link: Frequency Offset
      3. 12.5.3 Poor Link: Antenna
      4. 12.5.4 Bluetooth Low Energy: Device Does Advertising But Can Not Connect
      5. 12.5.5 Poor Sensitivity: DCDC Layout
      6. 12.5.6 Poor Sensitivity: Background noise
      7. 12.5.7 High Sleep Power Consumption
  15. 13References
  16. 14Revision History

3.1.2 32.768 kHz Crystal

The 32.768-kHz crystal is optional. The internal low-speed RC oscillator (32-kHz) can be used as a reference if the low-power crystal oscillator is not used. The RC oscillator can be calibrated automatically to provide a sleep timer accurate enough for Bluetooth® Low Energy. Using an external crystal has the advantage that it increases sleep clock accuracy and reduces the power consumption for Bluetooth Low Energy (shorter RX windows around connection events). An external crystal is required for time synchronous protocols such as TI 15.4-Stack and wM-Bus.