SWRZ134F April   2023  – September 2025 CC2340R5 , CC2340R5MODA

PRODUCTION DATA  

  1.   1
  2.   Abstract
  3. 1Advisories Matrix
  4. 2Nomenclature, Package Symbolization, and Revision Identification
    1. 2.1 Device Nomenclature
    2. 2.2 Devices Supported
    3. 2.3 Package Symbolization and Revision Identification
  5. 3Advisories
    1. 3.1 SPI_04
    2. 3.2 ADC_08
    3. 3.3 ADC_09
    4. 3.4 BATMON_01
    5. 3.5 CLK_01
    6. 3.6 CKM_01
    7. 3.7 I2C_01
    8. 3.8 GPIO_01
    9. 3.9 PMU_01
  6. 4Trademarks
  7. 5Revision History

2.3 Package Symbolization and Revision Identification

Figure 2-1 and Table 2-1 describe package symbolization and the device revision code.

CC2340R5 Package Symbolization QFNFigure 2-1 Package Symbolization QFN
Table 2-1 Revision Identification
Device Revision CodeVersion(1)
A0
B1 or 2(2)
(1) See CC2340xx Technical Reference Manual for the description of the SYS0:DEVICEID[31:28] VERSION bit field.
(2) CC2340R52 only

The device marking includes the part number CC2340Rxy where x denotes the amount of flash and y denotes the amount of RAM. ####### is the lot trace code. Optionally, 'X' following the TI letters indicates an experimental device. G4 is the environmental classification.

CC2340R5 Package Symbolization WCSPFigure 2-2 Package Symbolization WCSP

The device marking includes the part number CC2340R53. YM is the year/month code, LLLL is the assembly lot code, and S is the assembly site code. ##### is the wafer and die location information. Optionally, 'X' preceding the part number indicates an experimental device.