TIDUF44 January   2024

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
    1. 1.1 Key System Specifications
  8. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Highlighted Products
      1. 2.2.1 BQ76907
      2. 2.2.2 BQ76905
      3. 2.2.3 BQ77207
      4. 2.2.4 MSPM0L1106
      5. 2.2.5 TCAN1042
      6. 2.2.6 TPSM365R6V5
      7. 2.2.7 TLV704
      8. 2.2.8 TMP61
  9. 3System Design Theory
    1. 3.1 Primary Protection Design
    2. 3.2 Secondary Protection
    3. 3.3 Other Circuit Design
  10. 4Hardware, Software, Testing Requirements, and Test Results
    1. 4.1 Hardware Requirements
    2. 4.2 Software Requirements
    3. 4.3 Test Setup
    4. 4.4 Test Results
      1. 4.4.1 Cell Voltage Accuracy
      2. 4.4.2 Pack Current Accuracy
      3. 4.4.3 Protection
      4. 4.4.4 Cell Balancing
      5. 4.4.5 Working Modes Transition
      6. 4.4.6 Thermal Performance
  11. 5Design and Documentation Support
    1. 5.1 Design Files
      1. 5.1.1 Schematics
      2. 5.1.2 BOM
    2. 5.2 Tools and Software
    3. 5.3 Documentation Support
    4. 5.4 Support Resources
    5. 5.5 Trademarks
  12. 6About the Author

1.1 Key System Specifications

Table 1-1 Key System Specifications
PARAMETERCONDITIONSSPECIFICATION RANGEUNIT
MINTYPMAX
Cell architectureBQ7690737Series
BQ7690535Series
Cell balancing peak currentCell voltage: 4000 mV64mA
Charge current30A
Discharge current

30

A
Cell Voltage accuracy25°C±5mV
0°C–60°C±10mV
Pack current accuracy< 2 AmA
> 2 A%
Primary OV protectionThreshold4200mV
Delay2s
Secondary OV protectionThreshold4325mV
Delay1s
Primary UV protectionThreshold2530mV
Delay2s
OCD protection - level 1Threshold10A
Delay

0.46

1103.795

ms
OCD protection - level 2Threshold30A
Delay0.461103.795ms
OCC protectionThreshold10A
Delay0.461103.795ms
SCD protectionThreshold100A
Delay

8

300

8112

µs
Overtemperature protectionCharge55°C
Discharge60°C
Undertemperature protectionCharge0°C
Discharge–20°C
Shutdown mode current consumption for total design

2

μA

WARNING: TI intends this reference design to be operated in a lab environment only and does not consider the board to be a finished product for general consumer use.

TI Intends this reference design to be used only by qualified engineers and technicians familiar with the risks associated with handling high-voltage electrical and mechanical components, systems, and subsystems.

Hot surface! Contact can cause burns. Do not touch! Some components can reach high temperatures > 55°C when the board is powered on. Do not touch the board at any point during operation or immediately after operating, because high temperatures can be present.

CAUTION:

Do not leave the design powered when unattended.