Packaging terminology

Packaging terminology

Following are definitions for TI common package groups, families, and preference codes, along with other important terminology you may find helpful when evaluating TI’s packaging options.

Common package groups
BGA Ball Grid Array
CFP Both Formed and Unformed CFP = Ceramic Flat Pack
CGA Column Grid Array
COF Chip on Flex
COG Chip on Glass
DIP Dual In-Line Package or Dual Row Package
DLP Digital Light Processing
DSBGA Die Size Ball Grid Array,  also referred to as WCSP = Wafer Chip Scale Package
FCBGA Flip Chip Ball Grid Array
FCCSP Flip Chip Chip Scale Package
LCC Leaded Chip Carrier
LGA Land Grid Array
Module Module
nFBGA New Fine Pitch Ball Grid Array
NFMCA-LID Substrate Metal Cavity with Lid
OPTO Light Sensor Package = optical
PBGA Plastic Ball Grid Array
PFM Plastic Flange Mount Package
PGA Pin Grid Array
POS Package on Substrate
QFN Quad Flatpack No Lead
QFP Quad Flat Package
SIP Modules System in Package Modules
SIPP Single-In-Line Pin Package
SO Small Outline
SON Small Outline No Lead, also referred as DFN = Dual Flatpack No Lead
TO Transistor Outlines, also referred to as I2PAC or D2PAC
uCSP Micro Chip Scale Package
WCSP Wafer Chip Scale Package, also referred to as DSBGA
ZIP Zig-Zag In-Line
Package family
CBGA Ceramic Ball Grid Array
CDIP Glass-Sealed Ceramic Dual In-Line Package
CDIP SB Side-Braze Ceramic Dual In-Line Package
CPGA Ceramic Pin Grid Array
CZIP Ceramic Zig-Zag Package
DFP Dual Flat Package
DIMM Dual-In-Line Memory Module
FC/CSP Flip Chip / Chip Scale Package
HLQFP Thermally Enhanced Low Profile Quad Flat Package
HQFP Thermally Enhanced Quad Flat Package
HSOP Thermally Enhanced Small-Outline Package
HSSOP Thermally Enhanced Shrink Small-Outline Package
HTQFP Thermally Enhanced Thin Quad Flat Pack
HTSSOP Thermally Enhanced Thin Shrink Small-Outline Package
HVQFP Thermally Enhanced Very Thin Quad Flat Package
JLCC J-Leaded Ceramic or Metal Chip Carrier
LCCC Leadless Ceramic Chip Carrier
LPCC Leadless Plastic Chip Carrier
LQFP Low Profile Quad Flat Pack
MCM Multi-Chip Module
MQFP Metal Quad Flat Package
PDIP Plastic Dual-In-Line Package
PLCC Plastic Leaded Chip Carrier
PPGA Plastic Pin Grid Array
SDIP Shrink Dual-In-Line Package
SIMM Single-In-Line Memory Module
SODIMM Small Outline Dual-In-Line Memory Module
SOJ J-Leaded Small-Outline Package
SOP Small-Outline Package (Japan)
SSOP Shrink Small-Outline Package
TQFP Thin Quad Flat Package
TSOP Thin Small-Outline Package
TSSOP Thin Shrink Small-Outline Package
TVFLGA Thin Very-Fine Land Grid Array
TVSOP Very Thin Small-Outline Package
VQFP Very Thin Quad Flat Package
VSOP Very Small Outline Package
VSSOP Very Thin Shrink Small Outline Package, also referred as MSOP = Micro Small Outline Package
XCEPT Exceptions - May not be a real Package
Product preference code
A Requires department/business unit approval.
N Not recommended for new designs.
OK Use if a preferred package is not available.
P Preferred package. Package is qualified and orderable.
X Do not use. No longer supported. Not qualified. No longer tooled.
Assembly site The plant location(s) where a TI device is assembled.
Coplanarity The bottom surface of the package is parallel to the landing surface of the PCB.
Eligibility The device can be added to the ESL list immediately.
ePOD Enhanced Package Outline Drawing (Typically includes package outline, land pattern, and stencil design).
Extended shelf life TI offers extended shelf life of certain products to enable up to five years of total shelf life from the time the product is manufactured to the time it is delivered by TI or a TI authorized distributor.
Footprint The periphery leads and thermal pad of a "no-lead" package.

TI’s full definition of Green is within the TI Low Halogen (Green) Statement  found on our Environmental information page.

Data flags under the Green field can be:

Yes:  Fully compliant to TI Green definition.

No:  Not compliant to TI Green definition.

IEC 62474 DB

The IEC 62474 database (IEC 62474 DB) is the worldwide regulatory list of restricted substances, applications and thresholds as they apply to electronic products maintained by the IEC 62474 Validation Team committee. This list was the JIG-101 but was sunset in 2012 and became the IEC 62474 DB at that time.

TI products that are compliant to RoHS requirements are also fully compliant to the substances and thresholds defined in the IEC 62474 Database (was previously the Joint Industry Guide).

Data flags under the IEC 62474 DB field can be:

Yes:  Fully compliant to IEC 62474 DB.

Affected:  Compliant to IEC 62474 DB with the use of REACH SVHC substance(s) when contained above threshold, REACH SVHCs are not restricted from use but if contained above threshold, further information must be available.

No:  Not compliant to IEC 62474 DB.

JEDEC The JEDEC Standard for this package type.
Land pattern The pattern of solderable area on the PCB where a "no-lead" package may rest.
Lead finish/Ball material The current metal finish on the leads or solder balls of a device.
Length The length of the device (in millimeters).
Mass (mg) Representative device weight (per part) in milligrams.
Maximum height The maximum height above board surface form (in millimeters).
MSL rating/Peak reflow The moisture sensitivity level ratings and peak solder (reflow) temperatures. If 2 sets of MSL rating/Peak reflow are displayed, use the MSL rating associated with the actual reflow temperature that will be used to mount the part to the printed circuit board.
Package | Pins The TI package designator or package name for a device, or the number of pins for a device.
Pins The number of pins or terminals on the package.
Pitch The distance between the centers of adjacent pins (in millimeters).
Pkg Package designator code or package name used in TI part numbers.
PN type Indicates whether the part number is Pb-Free or standard.
PPM to Mass Percentage conversion table

Parts per million (PPM) to mass % table:

1 ppm = 0.0001 %

10 ppm = 0.001 %

100 ppm = 0.01 %

1000 ppm = 0.1 %

10000ppm = 1.0 %


The European Union’s Registration Evaluation, Authorization and restriction of Chemicals (EU REACH) that lists the Substances of Very High Concern (SVHC) as well as substances under restriction, REACH Annex XVII. The REACH SVHC list is usually updated 2 times per year and the REACH Annex XVII list updated as needed.  TI’s latest REACH statement is located on our Environmental information page.

Data flags under the REACH field can be:

Yes:  Fully compliant to EU REACH.

Affected: Only used when a REACH SVHC substance(s) is contained above threshold 0.1% REACH Article threshold.  Any REACH SVHC above the threshold is not restricted from use but if contained above threshold, further information must be available.

No:  Not compliant to EU REACH – a restricted substance(s) under REACH Annex XVII is contained outside of allowed application.

Recyclable metals - ppm

The WEEE Directive (Waste Electrical and Electronic Equipment) has created interest in recyclable metals. TI reports values at the mass (mg) and ppm level.  For WEEE, ppm calculations are at the component level.  An example for calculating the ppm gold content follows.

Example: ppm= 1,000,000 * total amount of gold in component (mg) / total component weight (mg)

Gold mass = 0.23mg & Component mass = 128mg

1,000,0000 * 0.23 mg gold / 128mg component = 1,797 ppm


On January 27, 2003, the European Union passed the "Restriction on Use of Hazardous Substances in Electrical and Electronic Equipment," or "RoHS" legislation 2002/95/EC, which became effective July 1, 2006. TI’s latest RoHS statement is found on our Environmental information page. It restricted the following substances at the homogenous (material) level with associated maximum thresholds.

1. Lead (Pb):                                                  0.1% (1000ppm)

2. Mercury (Hg):                                            0.1% (1000ppm)

3. Hexavalent Chromium (Cr6+):                  0.1% (1000ppm)

4. Cadmium (Cd):                                          0.01% (100ppm)

5. Polybrominated biphenyls (PBB):              0.1% (1000ppm)

6. Polybrominated diphenyl ethers (PBDE):  0.1% (1000ppm)

Since then, there have been several updates to the Directive, the major ones being 2011/65/EU on 8 June 2011 that recasted exemptions expiring in 2011 to future dates (most in 2016).  Amendment EU 2015/863 released on 4 June 2015 and comes into effect 22 July 2019 that added 4 phthalates to the list of 6 restricted substances:

7. Bis(2-ethylhexyl) phthalate (DEPH):          0.1% (1000ppm)

8. Butyl benzyl phthalate (BBP):                    0.1%  (1000ppm)

9. Dibutyl phthalate (DBP):                           0.1%  (1000ppm)

10. Diisobultyl phthalate (DIBP):                   0.1% (1000ppm)

Further revisions continue to be released and TI will maintain its documentation and requirements as they are released, including information on exemptions that may be required.

Data flags under the RoHS field can be:

Yes:  fully compliant to EU RoHS, no exemption required

Exempt:  fully compliant to EU RoHS, with an exemption applied

No:  Not compliant to EU RoHS

RoHS restricted substances – ppm calculation

The ppm calculations are at the homogeneous material level and are worst-case ppm for each RoHS substance. 

PPM = (mass of substance / mass of material) * 1,000,000 * total amount of each RoHS substance contained in the material.

EXAMPLE:  Lead (Pb) in leadframe example:

(mass of Lead: 0.006273 mg / total mass of leadframe: 62.730001mg) * 1,000,000 = 100 ppm

Search part number The TI or customer part number entered on the initial Search page.
Thermal pad = Exposed pad = Power pad The central pad on the landing surface of a package that is electrically and mechanically connected to the board for BLR and thermal performance improvements.
Thickness The maximum thickness of the package body (in millimeters).
TI part number The part number to use when placing orders.
Total device mass (mg) Weight of the component in milligrams.
Type The abbreviated acronymn for this type of package, also referred as Package Family.
Width The width of the device (in millimeters).