Waived DRC Error Report
C:/srf04/Agama/Agama_704k_EM_Designs/CC1352-P7EM-XD7793-XD24-PA24_10dBm/Cadence/allegro/CC1352-P7EM-XD7793-XD24-PA24_10dBm.brd
Tue Nov 24 10:52:55 2020

DRC Error Count Summary
DRC Error Type,DRC Error Count
Miscellaneous,25
Total DRC Errors,25

Detailed DRC Errors
Constraint Name,DRC Marker Location,Required Value,Actual Value,Constraint Source,Constraint Source Type,Element 1,Element 2,Comment
Via at SMD thru,(125.125 112.575),FALSE,TRUE,NONE,DESIGN,Via "Via_Chip  (123.175 112.525) (Gnd)",Pin "U1.49 (Gnd)",Vias used to ensure good connection to ground pad
Via at SMD thru,(125.125 112.575),FALSE,TRUE,NONE,DESIGN,Via "Via_Chip  (126.175 110.525) (Gnd)",Pin "U1.49 (Gnd)",Vias used to ensure good connection to ground pad
Via at SMD thru,(125.125 112.575),FALSE,TRUE,NONE,DESIGN,Via "Via_Chip  (123.175 110.525) (Gnd)",Pin "U1.49 (Gnd)",Vias used to ensure good connection to ground pad
Via at SMD thru,(125.125 112.575),FALSE,TRUE,NONE,DESIGN,Via "Via_Chip  (123.175 111.525) (Gnd)",Pin "U1.49 (Gnd)",Vias used to ensure good connection to ground pad
Via at SMD thru,(125.125 112.575),FALSE,TRUE,NONE,DESIGN,Via "Via_Chip  (123.175 113.525) (Gnd)",Pin "U1.49 (Gnd)",Vias used to ensure good connection to ground pad
Via at SMD thru,(125.125 112.575),FALSE,TRUE,NONE,DESIGN,Via "Via_Chip  (123.175 114.525) (Gnd)",Pin "U1.49 (Gnd)",Vias used to ensure good connection to ground pad
Via at SMD thru,(125.125 112.575),FALSE,TRUE,NONE,DESIGN,Via "Via_Chip  (127.175 110.525) (Gnd)",Pin "U1.49 (Gnd)",Vias used to ensure good connection to ground pad
Via at SMD thru,(125.125 112.575),FALSE,TRUE,NONE,DESIGN,Via "Via_Chip  (124.175 110.525) (Gnd)",Pin "U1.49 (Gnd)",Vias used to ensure good connection to ground pad
Via at SMD thru,(125.125 112.575),FALSE,TRUE,NONE,DESIGN,Via "Via_Chip  (125.175 110.525) (Gnd)",Pin "U1.49 (Gnd)",Vias used to ensure good connection to ground pad
Via at SMD thru,(125.125 112.575),FALSE,TRUE,NONE,DESIGN,Via "Via_Chip  (126.175 114.525) (Gnd)",Pin "U1.49 (Gnd)",Vias used to ensure good connection to ground pad
Via at SMD thru,(125.125 112.575),FALSE,TRUE,NONE,DESIGN,Via "Via_Chip  (127.175 114.525) (Gnd)",Pin "U1.49 (Gnd)",Vias used to ensure good connection to ground pad
Via at SMD thru,(125.125 112.575),FALSE,TRUE,NONE,DESIGN,Via "Via_Chip  (127.175 113.525) (Gnd)",Pin "U1.49 (Gnd)",Vias used to ensure good connection to ground pad
Via at SMD thru,(125.125 112.575),FALSE,TRUE,NONE,DESIGN,Via "Via_Chip  (126.175 113.525) (Gnd)",Pin "U1.49 (Gnd)",Vias used to ensure good connection to ground pad
Via at SMD thru,(125.125 112.575),FALSE,TRUE,NONE,DESIGN,Via "Via_Chip  (125.175 114.525) (Gnd)",Pin "U1.49 (Gnd)",Vias used to ensure good connection to ground pad
Via at SMD thru,(125.125 112.575),FALSE,TRUE,NONE,DESIGN,Via "Via_Chip  (124.175 114.525) (Gnd)",Pin "U1.49 (Gnd)",Vias used to ensure good connection to ground pad
Via at SMD thru,(125.125 112.575),FALSE,TRUE,NONE,DESIGN,Via "Via_Chip  (125.175 113.525) (Gnd)",Pin "U1.49 (Gnd)",Vias used to ensure good connection to ground pad
Via at SMD thru,(125.125 112.575),FALSE,TRUE,NONE,DESIGN,Via "Via_Chip  (124.175 113.525) (Gnd)",Pin "U1.49 (Gnd)",Vias used to ensure good connection to ground pad
Via at SMD thru,(125.125 112.575),FALSE,TRUE,NONE,DESIGN,Via "Via_Chip  (126.175 112.525) (Gnd)",Pin "U1.49 (Gnd)",Vias used to ensure good connection to ground pad
Via at SMD thru,(125.125 112.575),FALSE,TRUE,NONE,DESIGN,Via "Via_Chip  (127.175 112.525) (Gnd)",Pin "U1.49 (Gnd)",Vias used to ensure good connection to ground pad
Via at SMD thru,(125.125 112.575),FALSE,TRUE,NONE,DESIGN,Via "Via_Chip  (127.175 111.525) (Gnd)",Pin "U1.49 (Gnd)",Vias used to ensure good connection to ground pad
Via at SMD thru,(125.125 112.575),FALSE,TRUE,NONE,DESIGN,Via "Via_Chip  (126.175 111.525) (Gnd)",Pin "U1.49 (Gnd)",Vias used to ensure good connection to ground pad
Via at SMD thru,(125.125 112.575),FALSE,TRUE,NONE,DESIGN,Via "Via_Chip  (124.175 112.525) (Gnd)",Pin "U1.49 (Gnd)",Vias used to ensure good connection to ground pad
Via at SMD thru,(125.125 112.575),FALSE,TRUE,NONE,DESIGN,Via "Via_Chip  (125.175 112.525) (Gnd)",Pin "U1.49 (Gnd)",Vias used to ensure good connection to ground pad
Via at SMD thru,(125.125 112.575),FALSE,TRUE,NONE,DESIGN,Via "Via_Chip  (125.175 111.525) (Gnd)",Pin "U1.49 (Gnd)",Vias used to ensure good connection to ground pad
Via at SMD thru,(125.125 112.575),FALSE,TRUE,NONE,DESIGN,Via "Via_Chip  (124.175 111.525) (Gnd)",Pin "U1.49 (Gnd)",Vias used to ensure good connection to ground pad

