COPYRIGHT (C) 2021 TESSOLVE SEMICONDUCTOR PVT. LTD., ALL RIGHTS RESERVED
THE INFORMATION CONTAINED HEREIN IS THE EXCLUSIVE PROPERTY OF TESSOLVE SEMICONDUCTOR PVT. LTD.
AND SHALL NOT BE DISTRIBUTED AND SHALL NOT REPRODUCED OR DISCLOSED IN WHOLE OR IN PART WITHOUT 
PRIOR WRITTEN PERMISSION OF TESSOLVE SEMICONDUCTOR PVT. LTD.
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CUSTOMER		-	TI          	
CARD NAME		-	308723-8721-1DU   	
PART NUMBER		-	DLP055C
DATE                   	-	16-Apr-2021
DESIGNED AT     	-	Tessolve Semiconductor Pvt. Ltd.
CONTACT E-Mail ID	-	engineering_cbe@tessolve.com
GERBER FORMAT 		-	RS274X , ENGLISH  2,5 LEADING
DRILL FORMAT 		-	EXCELLON ENGLISH  2,5 TRAILING
PACKAGE NAME   		-	DLP055C_8721-1DU_ASSY.zip

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LIST OF FILES INSIDE PACKAGE:

ASSYB.art				- Assembly layer Bottom Side
ASSYT.art				- Assembly layer Top Side
SPT.art					- Solder Paste Top Side
SPB.art					- Solder Paste Bottom Side
PICK&PLACE.txt				- Pick and Place data (Placement file)
GENCAD.txt				- GENCAD file 
ASSY.pdf				- PDF of Assembly Drawings
FAB.pdf		   			- PDF of Fabrication Drawing
DLP055C_SCH.pdf  	                - PDF of Schematic Drawing
DLP055C_BOM.xlsx  	                - Bill of Material file
ODB++.tgz	      			- ODB++ file
Readme_Asy.txt	       			- This file