COPYRIGHT (C) 2025 TESSOLVE SEMICONDUCTOR PVT. LTD., ALL RIGHTS RESERVED
THE INFORMATION CONTAINED HEREIN IS THE EXCLUSIVE PROPERTY OF TESSOLVE SEMICONDUCTOR PVT. LTD.
AND SHALL NOT BE DISTRIBUTED AND SHALL NOT REPRODUCED OR DISCLOSED IN WHOLE OR IN PART WITHOUT 
PRIOR WRITTEN PERMISSION OF TESSOLVE SEMICONDUCTOR PVT. LTD.
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CUSTOMER                   -	TI           	
CARD NAME                  -	TIDM-02022         	
PART NUMBER                -	TS37485AC0 	    	
DATE                       -	05-AUG-2025 
DESIGNED AT                -	Tessolve Semiconductor Pvt. Ltd. 
CONTACT E-Mail ID          -	engineering_cbe@tessolve.com 
GERBER FORMAT              -	RS274X , ENGLISH  2,5 LEADING 
PACKAGE NAME               -	TS37485AC0_TIDM-02022_ASY_20250805.zip 
   
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LIST OF FILES INSIDE PACKAGE: 
   
TIDM-02022E1.GTP 		- Solder Paste Top Side 
TIDM-02022E1.GBP 		- Solder Paste Bottom Side 
TIDM-02022E1.GM5 		- Assembly Drawing Top Side 
TIDM-02022E1.GM6 		- Assembly Drawing Bottom Side 
TIDM-02022E1.GM1 		- Board Outline 
 
 
OTHER FILES: 
 
Pick & Place.xlsx     			- Pick and Place data [Placement file]
ASY.pdf                    		- PDF of Assembly Drawings [Top and Bottom side]
3D_ASY.PDF				- 3D_PDF of Assembly Drawings [Top and Bottom side]
SCH.pdf					- PDF of schematic Drawings
ODB++_TS37485AC0_TIDM-02022.tgz		- ODB++ file
TS37485AC0_TIDM-02022_BOM.xlsx     	- Bill of Material file
Readme_Asy.txt             		- This file
 
