Quality & reliability


Material content search

Details for "LM3530UMX-40B/NOPB" ACTIVE

Choose a download method for component information:

Or

Current Product Information

TI part number Lead finish/Ball material MSL rating/Peak reflow Assembly site Package | Pins Package body size (mm) Total device mass (mg) *
LM3530UMX-40B/NOPB SNAGCU Level-1-260C-UNLIM Texas Instruments Electronics YFZ | 12 1.25x1.65x.304 2.200000

*Total device mass (mg)
The summary mass is a rounded value and will be within approximately +/- 10% of the detailed mass value.

Environmental Ratings Information

RoHS REACH Green status IEC 62474 DB
Yes Yes Yes Yes

Component Information

  Homogeneous Material Level Component Level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Semiconductor Device
Ceramics / Glass Doped Silicon 7440-21-3 1.464126 100.000000 1000000 66.964229 669642
Sub-Total     1.464126 100 1000000 66.964229 669642
Solder Bump
Copper and Its Alloys Copper 7440-50-8 0.003612 0.500066 5001 0.165201 1652
Nickel and Its Alloys Nickel 7440-02-0 0.000361 0.049979 500 0.016511 165
Other Nonferrous Metals and Alloys Tin 7440-31-5 0.709663 98.249906 982499 32.457614 324576
Precious Metals Silver 7440-22-4 0.008668 1.200049 12000 0.396445 3964
Sub-Total     0.722304 100 1000000 33.035771 330358

Total

    2.186430     100 1000000

Important Information/Disclaimer

TI bases its material content information on information provided by third-party suppliers and has taken, and continues to take, reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers may consider certain information to be proprietary, and thus certain information may not be available for release by TI. The material content information is provided by TI "as is."
For additional information, please contactTI customer support