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Details for "LP5907UVE-1.2/NOPB"

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Current Product Information

TI part number Lead/ball finish MSL / reflow ratings Assembly site Package | pins Package body size (mm) Total device mass (mg) *
LP5907UVE-1.2/NOPB SNAGCU Level-1-260C-UNLIM Texas Instruments Electronics YKE | 4 .685x.685x.304 0.500000

*Total device mass (mg)
The summary mass is a rounded value and will be within approximately +/- 10% of the detailed mass value.

Environmental Ratings Information

RoHS status REACH status Green status IEC 62474 DB
Y Y Y Y

Component Information

  Homogeneous Material Level Component Level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Semiconductor Device
Ceramics / Glass Doped Silicon 7440-21-3 0.333093 100.000000 1000000 72.988128 729881
Sub-Total     0.333093 100 1000000 72.988128 729881
Solder Bump
Copper and Its Alloys Copper 7440-50-8 0.000616 0.499704 4997 0.134979 1350
Nickel and Its Alloys Nickel 7440-02-0 0.000062 0.050295 503 0.013586 136
Other Nonferrous Metals and Alloys Tin 7440-31-5 0.121116 98.250225 982502 26.539225 265392
Precious Metals Silver 7440-22-4 0.001479 1.199776 11998 0.324082 3241
Sub-Total     0.123273 100 1000000 27.011872 270119

Total

    0.456366     100 1000000

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