Quality & reliability


Material content search

Details for "LM2592HVSX-ADJ/E7001842"

Choose a download method for component information:

Or

Current Product Information

TI part number Lead finish/Ball material MSL rating/Peak reflow Assembly site Package | Pins Package body size (mm) Total device mass (mg) *
LM2592HVSX-ADJ/E7001842 SNPB Level-3-235C-168 HR Texas Instruments Electronics KTT | 5 10.2 x 9 x 4.5 1,604.200000

*Total device mass (mg)
The summary mass is a rounded value and will be within approximately +/- 10% of the detailed mass value.

Environmental Ratings Information

RoHS REACH Green status IEC 62474 DB
No Affected No No
The lead (Pb) CAS# 7439-92-1 content for this component exceeds the REACH SVHC limit of 0.1%. Please refer to the material content report for further details.

Component Information

  Homogeneous Material Level Component Level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys Copper 7440-50-8 0.730293 99.992059 999921 0.045525 455
Copper and Its Alloys Iron 7439-89-6 0.000007 0.000958 10 0.000000 0
Nickel and Its Alloys Nickel 7440-02-0 0.000011 0.001506 15 0.000001 0
Other Inorganic Materials Sulfur 7704-34-9 0.000011 0.001506 15 0.000001 0
Other Nonferrous Metals and Alloys Manganese 7439-96-5 0.000011 0.001506 15 0.000001 0
Precious Metals Silver 7440-22-4 0.000018 0.002465 25 0.000001 0
Sub-Total     0.730351 100 1000000 0.045528 455
Die Attach Adhesive
Other Nonferrous Metals and Alloys Lead 7439-92-1 5.505718 95.499996 955000 0.343212 3432
Other Nonferrous Metals and Alloys Tin 7440-31-5 0.115303 2.000000 20000 0.007188 72
Precious Metals Silver 7440-22-4 0.144129 2.500004 25000 0.008985 90
Sub-Total     5.765150 100 1000000 0.359385 3594
Lead Frame
Copper and Its Alloys Copper 7440-50-8 794.947566 99.600040 996000 49.554976 495550
Copper and Its Alloys Phosphorus 7723-14-0 0.079806 0.009999 100 0.004975 50
Other Nonferrous Metals and Alloys Tin 7440-31-5 1.197090 0.149990 1500 0.074620 746
Precious Metals Silver 7440-22-4 1.915344 0.239976 2400 0.119398 1194
Sub-Total     798.139806 100 1000000 49.753972 497540
Lead Frame Plating
Other Nonferrous Metals and Alloys Lead 7439-92-1 2.538200 37.000000 370000 0.158200 1582
Other Nonferrous Metals and Alloys Tin 7440-31-5 4.321800 63.000000 630000 0.269400 2694
Sub-Total     6.860000 100 1000000 0.427600 4276
Mold Compound
Other Inorganic Materials Fused Silica 60676-86-0 699.776688 89.000000 890000 43.622269 436223
Other Nonferrous Metals and Alloys Metal Hydroxide Trade Secret 23.587978 3.000000 30000 1.470414 14704
Thermoplastics Epoxy 85954-11-6 62.901275 8.000000 80000 3.921103 39211
Sub-Total     786.265941 100 1000000 49.013786 490138
Semiconductor Device
Ceramics / Glass Doped Silicon 7440-21-3 6.411799 100.000000 1000000 0.399695 3997
Sub-Total     6.411799 100 1000000 0.399695 3997

Total

    1,604.173047     100 1000000

Important Information/Disclaimer

TI bases its material content information on information provided by third-party suppliers and has taken, and continues to take, reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers may consider certain information to be proprietary, and thus certain information may not be available for release by TI. The material content information is provided by TI "as is."
For additional information, please contactTI customer support