Quality & reliability


Material content search

Details for "LM6588MAX/NOPB" NOT RECOMMENDED FOR NEW DESIGNS

Choose a download method for component information:

Or

Current Product Information

TI part number Lead finish/Ball material MSL rating/Peak reflow Assembly site Package | Pins Package body size (mm) Total device mass (mg) *
LM6588MAX/NOPB SN Level-1-260C-UNLIM Texas Instruments Electronics D | 14 8.7 x 3.9 x 1.75 150.500000

*Total device mass (mg)
The summary mass is a rounded value and will be within approximately +/- 10% of the detailed mass value.

Environmental Ratings Information

RoHS REACH Green status IEC 62474 DB
Yes Yes Yes Yes

Component Information

  Homogeneous Material Level Component Level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys Copper 7440-50-8 0.070689 99.998585 999986 0.046966 470
Precious Metals Silver 7440-22-4 0.000001 0.001415 14 0.000001 0
Sub-Total     0.070690 100 1000000 0.046967 470
Die Attach Adhesive
Precious Metals Silver 7440-22-4 0.271518 75.000000 750000 0.180397 1804
Thermoplastics Epoxy 85954-11-6 0.090506 25.000000 250000 0.060132 601
Sub-Total     0.362024 100 1000000 0.240529 2405
Lead Frame
Copper and Its Alloys Copper 7440-50-8 41.600340 96.700000 967000 27.639310 276393
Copper and Its Alloys Iron 7439-89-6 1.023876 2.380000 23800 0.680264 6803
Copper and Its Alloys Phosphorus 7723-14-0 0.012906 0.030000 300 0.008575 86
Precious Metals Silver 7440-22-4 0.331254 0.770000 7700 0.220086 2201
Zinc and Its Alloys Zinc 7440-66-6 0.051624 0.120000 1200 0.034299 343
Sub-Total     43.020000 100 1000000 28.582536 285825
Lead Frame Plating
Other Nonferrous Metals and Alloys Tin 7440-31-5 1.600000 100.000000 1000000 1.100000 10630
Sub-Total     1.600000 100 1000000 1.100000 10630
Mold Compound
Other Inorganic Materials Fused Silica 60676-86-0 92.714689 89.000000 890000 61.599743 615997
Other Nonferrous Metals and Alloys Metal Hydroxide Trade Secret 3.125214 3.000000 30000 2.076396 20764
Thermoplastics Epoxy 85954-11-6 8.333905 8.000000 80000 5.537056 55371
Sub-Total     104.173808 100 1000000 69.213194 692132
Semiconductor Device
Ceramics / Glass Doped Silicon 7440-21-3 1.284965 100.000000 1000000 0.853732 8537
Sub-Total     1.284965 100 1000000 0.853732 8537

Total

    150.511487     100 1000000

Important Information/Disclaimer

TI bases its material content information on information provided by third-party suppliers and has taken, and continues to take, reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers may consider certain information to be proprietary, and thus certain information may not be available for release by TI. The material content information is provided by TI "as is."
For additional information, please contactTI customer support