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Details for "LM35DM/NOPB"

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Current Product Information

TI part number Lead/ball finish MSL / reflow ratings Assembly site Package | pins Package body size (mm) Total device mass (mg) *
LM35DM/NOPB CU SN Level-1-260C-UNLIM Ext-Mfg D | 8 4.9 x 3.9 x 1.75 81.900000

*Total device mass (mg)
The summary mass is a rounded value and will be within approximately +/- 10% of the detailed mass value.

Environmental Ratings Information

RoHS status REACH status Green status IEC 62474 DB
Y Y Y Y

Component Information

  Homogeneous Material Level Component Level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Precious Metals Gold 7440-57-5 0.080000 100.000000 1000000 0.100000 977
Sub-Total     0.080000 100 1000000 0.100000 977
Die Attach Adhesive
Precious Metals Silver 7440-22-4 0.264212 74.999929 749999 0.322739 3227
Thermoplastics Epoxy 85954-11-6 0.088071 25.000071 250001 0.107580 1076
Sub-Total     0.352283 100 1000000 0.430319 4303
Lead Frame
Copper and Its Alloys Copper 7440-50-8 20.035720 96.604240 966042 24.473920 244739
Copper and Its Alloys Iron 7439-89-6 0.493440 2.379170 23792 0.602740 6027
Copper and Its Alloys Phosphorus 7723-14-0 0.006168 0.029740 297 0.007534 75
Copper and Its Alloys Zinc 7440-66-6 0.024672 0.118959 1190 0.030137 301
Precious Metals Silver 7440-22-4 0.180000 0.870000 8679 0.220000 2199
Sub-Total     20.740000 100 1000000 25.334212 253342
Lead Frame Plating
Other Nonferrous Metals and Alloys Tin 7440-31-5 1.600000 100.000000 1000000 2.000000 19544
Sub-Total     1.600000 100 1000000 2.000000 19544
Mold Compound
Other Inorganic Materials Fused Silica 60676-86-0 50.869395 88.000000 880000 62.137706 621377
Thermoplastics Epoxy 85954-11-6 6.936736 12.000000 120000 8.473324 84733
Sub-Total     57.806131 100 1000000 70.611030 706110
Semiconductor Device
Ceramics / Glass Doped Silicon 7440-21-3 1.287169 100.000000 1000000 1.572296 15723
Sub-Total     1.287169 100 1000000 1.572296 15723

Total

    81.865583     100 1000000

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