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Details for "MSP430F2001IPWR"

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Current Product Information

TI part number Lead/ball finish MSL / reflow ratings Assembly site Package | pins Package body size (mm) Total device mass (mg) *
MSP430F2001IPWR CU NIPDAU Level-1-260C-UNLIM TI MALAYSIA A/T PW | 14 4.4x5x1.15 68.300000

*Total device mass (mg)
The summary mass is a rounded value and will be within approximately +/- 10% of the detailed mass value.

Environmental Ratings Information

RoHS status REACH status Green status IEC 62474 DB
Y Y Y Y

Component Information

  Homogeneous Material Level Component Level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys Copper 7440-50-8 0.060941 99.998359 999984 0.089267 893
Precious Metals Silver 7440-22-4 0.000001 0.001641 16 0.000001 0
Sub-Total     0.060942 100 1000000 0.089269 893
Die Attach Adhesive
Precious Metals Silver 7440-22-4 0.630661 80.000025 800000 0.923799 9238
Thermoplastics Epoxy 85954-11-6 0.157665 19.999975 200000 0.230950 2309
Sub-Total     0.788326 100 1000000 1.154749 11547
Lead Frame
Copper and Its Alloys Copper 7440-50-8 28.670880 97.520000 975200 41.997430 419974
Copper and Its Alloys Iron 7439-89-6 0.676200 2.300000 23000 0.990500 9905
Copper and Its Alloys Phosphorus 7723-14-0 0.008820 0.030000 300 0.012920 129
Zinc and Its Alloys Zinc 7440-66-6 0.044100 0.150000 1500 0.064600 646
Sub-Total     29.400000 100 1000000 43.065460 430655
Lead Frame Plating
Nickel and Its Alloys Nickel 7440-02-0 1.141440 95.120000 951200 1.671990 16720
Precious Metals Gold 7440-57-5 0.009360 0.780000 7800 0.013710 137
Precious Metals Palladium 7440-05-3 0.049200 4.100000 41000 0.072100 721
Sub-Total     1.200000 100 1000000 1.757770 17578
Mold Compound
Other Inorganic Materials Fused Silica 60676-86-0 29.447879 85.999999 860000 43.135592 431356
Other Plastics and Rubber Carbon Black 1333-86-4 0.102725 0.300000 3000 0.150473 1505
Thermoplastics Epoxy 85954-11-6 4.691116 13.700001 137000 6.871601 68716
Sub-Total     34.241720 100 1000000 50.157665 501577
Semiconductor Device
Ceramics / Glass Doped Silicon 7440-21-3 2.577182 100.000000 1000000 3.775086 37751
Sub-Total     2.577182 100 1000000 3.775086 37751

Total

    68.268170     100 1000000

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